M. Keikhaie

[ 1 ] - Thermal Analysis of Sintered Silver Nanoparticles Film

Thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. Thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in material...