نتایج جستجو برای: eutectic alloy

تعداد نتایج: 55919  

2004
L. Qi H. F. Zhang Z. Q. Hu

Based on the embedded-atom method, a constant-pressure, constant-temperature molecular dynamics technique is applied to obtain an atomic description of glass formation process in eutectic Cu40Ag60 alloy. By using radial distribution function and pair analysis methods, the structure and glass forming ability of this alloy is studied by quenching from the liquid at different cooling rates (1 £ 10...

2005
Abdul-Majeed Azad

Liquid metals such as Bi and Pb and Pb–Bi eutectic alloy are serious contenders for use as coolant in LMFBRs in lieu of sodium due to a number of attractive characteristics (high density, low moderation, low neutron absorption and activation, high boiling point and poor interaction with water and air, etc.). Analysis of hypothetical accidents is of relevance to predict the catastrophe involving...

2000
H. Tostmann P. S. Pershan

We report an x-ray scattering study of the microscopic structure of the surface of a liquid alkali metal. The bulk liquid structure factor of the eutectic K67Na33 alloy is characteristic of an ideal mixture, and so shares the properties of an elemental liquid alkali metal. Analysis of off-specular diffuse scattering and specular x-ray reflectivity shows that the surface roughness of the K-Na al...

2014
J. PIĄTKOWSKI R. WIESZAŁA

J. Piątkowski The Silesian University of Technology, Faculty of Materials Science and Metallurgy, Katowice, Poland R. Wieszała, The Silesian University of Technology, Faculty of Transport, Katowice, Poland The paper presents microstructure tests of alloy AlSi17Cu5. In order to disintegrate the primary grain of silicon the so-called time-temperature transformation TTT was applied which was based...

2002
Seok-Hwan Huh Keun-Soo Kim Katsuaki Suganuma

The effect of Au addition on the microstructural and the tensile properties of Sn–0.7 mass%Cu alloy was examined. Tensile strength and 0.2% proof stress remarkably increase up to 0.3 mass%Au primarily due to solid solution hardening. Beyond 0.3 mass%Au, due to precipitation of large intermetallic compounds, elongation decreases while tensile strength and 0.2% proof stress increase slightly. Wit...

2014

J. Piątkowski, The Silesian University of Technology, Faculty of Materials Science and Metallurgy, Katowice, Poland The paper presents chosen properties and microstructure of AlSi17Cu5Mg alloy as future material for casting pistons in automotive industry. Tests were conducted to elaborate technology of preparation, assessment of crystallisation parameters and shaping the primary structure of th...

2011
H. Ghazvinizadeh

The ASTM F-75 (Co-28%Cr-6%Mo) is widely used as a biocompatible alloy in medicine for manufacturing implants. In this study, effect of mold preheating on the as-cast microstructure of the alloy was investigated using the solid investment casting process. Several mold preheating temperatures of 550, 700, 850 and 1000 °C were selected at the same melt superheat. The samples were characterized by ...

2012
Niels Quack

An AlGe eutectic wafer level bonding process is presented and characterized for heterogeneous integration of silicon photonics, CMOS integrated electronic circuits and active III-V components. Heterogeneous Integration of Photonics and CMOS The technology of silicon photonics integrated circuits (SiPIC) currently finds itself transitioning from research to industrial scale production [1]. The p...

2014
Vandana J Rao

Modification of primary silicon was studied in Al-Si hypereutectic alloys with 17 Wt % silicon content. The alloys modified through non-conventional method using oxide addition. The effect of oxide on the morphology and size of Si phases in the hypereutectic Al-Si alloys investigated. The results show that the addition of MnO2 to the hypereutectic Al-Si alloys can modify the primary Si phases. ...

Journal: :CoRR 2006
Jeong-Won Yoon Hyun-Suk Chun Ja-Myeong Koo Seung-Boo Jung

As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a coelectroplating process, it was possible to plate the Au-Sn solder directly onto a wafer at or near the eutectic composition from a single solution. Two distinct phases, Au5Sn and AuSn, were deposited at a composition of 30at.%Sn...

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