Recent developments in grinding have opened up new avenues for finishingof hard and brittle materials with Nano-surface finish, high tolerance and accuracy.Grinding with super abrasive diamond wheels is an excellent way to produce ultraprecision surface finish. However, super abrasive diamond grits need higher bondingstrength while grinding, which metal-bonded grinding wheels ca...

The comminution process, particularly grinding, is very important in the mineral processing industry. Some characteristics of ore particles, which occur as a product of grinding process, have a significant impact on the effects of further ore processing. At the same time, this process requires a significant amount of energy which significantly affects the overall processing costs. Therefore, in...

Mill load is an important equipment index which is closely related to operating efficiency, product quality and energy consumption of grinding process. Due to high dimension and collinearity of spectral data, mill load model has high complexity, poor interpretability and generalization. A soft sensor modeling method of mill load parameters is proposed based on frequency spectrum feature using S...

conputer pror,rae1 descrihed for practical optinization plun?;e grindin>; on steels. Tl1e program based on a strategy desiv,ned to o;Hi!'1ize both the grinding and dress "~nr, <Jara!'1eters maxil'1um metal removal rate, to constraints of surface finish and burning of the Forkpiece. The operates with a desktop micro-computer. performin?: the optimization, the user inputs the present grinding dre...

Ore grinding system is a multivariable mechanism which is used in mining industry, metallurgy, cement production, chemicals, pharmaceuticals, ceramics and various research laboratories. Previous control methods of this system include open multi-loop PID controller, Model Predictive Control (MPC), adaptive control and robust control. The mentioned techniques do not show proper performance, when ...

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two oth...

A variety of aromatic amines/hydrazides and aldehydes have been utilized for the construction of crystalline COFs at a faster rate and in high yield, irrespective of their reactivity and solubility using the Liquid-Assisted Grinding (LAG) method.

Surface roughness is a variable often used to describe the quality of ground surfaces as well as to evaluate the competitiveness of the overall grinding system. The subject of this paper is a grinding process performed on P20 tool steel by changing the grinding conditions, including the depth of cut, the grinding passes, the type of wheel, and the cutting fluid supply in the experiment. The mai...

A simple and effective solution to the robot grinding problem is introduced, which significantly reduces vibrations during grinding without additional actuators or active control. The objective is to determine the optimal compliance design for grinding robot tool holders. Specifically, the tool holder design should improve accuracy and productivity while protecting the robot arm from the large ...

In this investigation, experiments were carried out to understand the influence of various grinding parameters like wheel speed, workspeed and depth of cut on the grinding temperature at the surface of the Al-SiCP composite workpiece with different grinding wheels. The temperature distribution within the workpiece was studied by simulating the grinding process and using finite element analysis ...