Finite element analysis facilitates optimal design of MEMS/NEMS devices for reliability. The same is used here to analyze the effect of types of fractal rough surfaces on static response of nanobeams Three-dimensional rough surfaces are generated using modified two variable Weierstrass-Mandelbrot function with given fractal parameters. Beam with various fractal roughness are modelled to observe...

An electrostatic torsion micromirror is designed using the optimized spring-shaped torsion beams and U-shaped groove supporters. The main advantages of this design will be a reduction in the pull-in voltage for low-voltage applications and the function as a switch of the instability mode by adjusting the effective bending stiffness of the torsion beam. In this design, a theoretical model is dev...

Lower limbs are normally the first contacted body region during car-pedestrian accidents, and easily suffer serious injuries. The previous tibia bending tolerances for pedestrian safety were mainly developed from three-point bending tests on tibia mid-shaft. The tibia tolerances of other locations are still not investigated enough. In addition, tibia loading condition under the car-pedestrian i...

the purpose of this study is to determine the effect of vierendeel panel width and vertical truss spacing ratio in an inelastic behavior of the stf system due to earthquake loads. the stf system is applied to a six-storey building that serves as apartments [2]. the stf system is used in the building in the transverse direction (n-s direction), while in the longitudinal direction (w-e direction)...

We used a spray-coating process to cover silicon microcantilevers with ca. 33 wt% [Fe(Htrz)2(trz)](BF4)@P(VDF70-TrFE30) nanocomposite thin films of 1500 nm thickness. The bilayer cantilevers were then investigate the thermomechanical properties composites through combined static and dynamic flexural analysis. out-of-plane resonance frequencies assess Young’s modulus spray-coated (3.2 GPa). Then...

This paper reports the successful substrate transfer based on standard IC processing to an alternative substrate e.g. plastic. The device on ultra-thin Si substrate using grinding backside Si and thermo-compression bonding process is proposed. Acceptable electrical performances are achieved means that the substrate transfer process is controlled well. The DC characteristics of nMOSFETs as a fun...