The short and long term reliability of National Semiconductor’s interface circuits, like any integrated circuit, is very dependent on its environmental condition. Beyond the mechanical/environmental factors, nothing has a greater influence on this reliability than the electrical and thermal stress seen by the integrated circuit. Both of these stress issues are specifically addressed on every in...

Thermal stress can induce birefringence in a laser medium, which can cause depolarization of the laser. The depolarization effect will be very severe in a high-average-power laser. Because the depolarization will make the frequency doubling efficiency decline, it should be compensated. In this paper, the thermal characteristics of two kinds of materials are analyzed in respect of temperature, t...

Thermal stress and predation risk have profound effects on rocky shore organisms, triggering changes in their feeding behaviour, morphology and metabolism. Studies of thermal stress have shown that underpinning such changes in several intertidal species are specific shifts in gene and protein expression (e.g. upregulation of heat-shock proteins). But relatively few studies have examined genetic...

Thermal stress including temperature gradients in time and space, as well as thermal cycling, influences lifetime reliability and performance of modern Multiprocessor Systemson-Chip (MPSoCs). Conventional power and temperature management techniques considering the peak temperature/power consumption do not provide a comprehensive solution to avoid high spatial and temporal thermal variations. Th...

This paper presents a new strategy to synthesis optimum controllable heat exchanger networks; the proposed strategy consists of four sequential steps: i) Quantification of index of structural controllability. ii) Exergy analysis and normalized irreversibility. iii) Thermal effectiveness of network. iv) Fuzzy analogical gates network and selection of the best weight index. Two analogical gates (...

Analysis for the generalized thermoelastic Lamb waves, which propagates in anisotropic thin plates in generalized thermoelasticity, is presented employing normal mode expansion method. The displacement and temperature fields are expressed by a summation of the symmetric and antisymmetric thermoelastic modes in the surface thermal stresses and thermal gradient free orthotropic plate, therefore t...

In this paper the Quasi-Static poro-thermoelasticity model of a hollow and solid sphere under radial symmetric loading condition (r, t) is considered. A full analytical method is used and an exact unique solution of the Quasi-Static equations is presented. The thermal, mechanical and pressure boundary conditions, the body force, the heat source and the injected volume rate per unit volume of a ...

In this paper the classic coupled thermoporoelasticity model of hollow and solid cylinders under radial symmetric loading condition (r, t) is considered. A full analytical method is used and an exact unique solution of the classic coupled equations is presented. The thermal and pressure boundary conditions, the body force, the heat source, and the injected volume rate per unit volume of a distr...