Vegetation moderates a microclimate by casting shadows, increasing light reflection, evaporation and perspiration; and correcting wind patterns. The present study aims to investigate the microclimatic role of vegetated surfaces and bodies in improving thermal comfort in outdoor spaces between buildings. The main research question is which of the green system modes, that is, horizontal vegetatio...

We propose a novel approach based on dual filtering techniques for the detection of possible variations of the thermal properties of the spacecraft that result from variations of its physical properties and for determining a complete thermal mapping of the system. System and sensor uncertainties are taken into account in the lumped parameter modeling of the thermal system and a dual filter is r...

Olivine comprises >60% of the upper mantle, making it the dominant control on heat transport through the lithosphere. Accurate estimates of the thermal diffusivity and thermal conductivity are important to modeling geotherms, estimating lithospheric thickness, determining the depth range of melt generation, etc. Diffusivity and conductivity result from lattice vibration and radiative transport ...

Switched reluctance motors (SRM) are attracting much attention because of their special advantages. Generated heat, due to losses, can reduce the life time of SRMs. Therefore, taking into account thermal modeling helps to improve their performance and increase their life time. In this paper, a lumped thermal model of SRM based on the analogue circuit of conductive and convective thermal resista...

Shoulder geometry of tool plays an important role in friction-stir welding because it controls thermal interactions and heat generation. This work is proposed and developed a coupled rigid-viscoplastic numerical modeling based on computational fluid dynamics and finite element calculations aiming to understand these interactions. Model solves mass conservation, momentum, and energy equations in...

While still expanding in the microwave arena, GaNbased HEMTs are increasingly making their way into the field of high-power switching thanks to the material’s advantages in terms of power handling and switching frequency capabilities [1]-[6]. Since high-power applications demand particularly strenuous attention to thermal considerations, thermal modeling of GaN-HEMTs has attracted more and more...

This paper addresses the differences in thermal characterization and modeling for a multi-chip package with respect to a single-chip package. Since no thermal measurement system is commercially available to power more than one device during the test, the thermal model can be validated only with a single-heat source. Wires, which are used to connect the package under the test to the measurement ...