Technology for power systems of modern computer/telecom equipment is facing extremely tough challenges due to continuously increasing power-density and efficiency requirements. Meeting these requirements will require significant technology advancements in system architectures, devices and materials, topology optimization, and packaging/thermal design. In this paper, major technology challenges ...

rapid thermal processing (rtp) has become a key technology for semiconductor device manufacturing in a variety of applications, such as thermal oxidation, annealing, and thin-film growth. hence, understanding the radiative properties of silicon and other relevant materials is essential for the analysis of the thermal transport processes. we have analyzed and calculated the spectral, directional...

The thermal management of integrated circuits is an increasing challenge, limiting the progression of technology, and making microchip designs complex. The research and development of thermal management has concentrated on reducing the total power consumption of microprocessors at the micro-architectural level. At this level, constraints such as power consumption and its sources are regarded hi...

Primary oil recovery methods in Saskatchewan’s heavy oil basin extract 5 to 10% of the available resource with the vast majority left in the ground and recoverable only through Enhanced Oil Recovery (EOR) methods. Traditional EOR generates steam in surface facilities and injects it underground to mobilize the oil for production with considerable energy losses inherent in the process. R.I.I. Nor...

Dynamic thermal ratings have the potential to offer a costeffective alternative to network reinforcement for Distribution Network Operators looking to accommodate load growth or distributed generation connections. A review of the state of the art regarding dynamic thermal rating technologies around the world is presented. Focusing on overhead lines, a survey and evaluation of the various techno...

As technology advances, understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will investigate thermal management issues of high frequency PCB’s as it relates to material properties, insertion loss and circuit design configurations. It will be shown that there are many tradeoffs between thes...

Current rapid development in MEMS area has opened up many possibilities in nano-technology such as nano-fabrication. Among them is nanoscale wiring by both AFM (Atomic Force Microscope) tip and laser beam. Being able to make a relatively small deflection, a micro thermal actuator can be used to control the near field optics of the beam minutely and accurately. In this project, we will investiga...