in this paper, wavelet collocation method has been used to solve nonlinear fin problem with temperature dependent thermal conductivity and heat transfer coefficient. thermal conductivity of fin materials varies any type so that we consider thermal conductivity as the general function of temperature.  here we consider three particular cases, where we assume that thermal conductivity is constant,...

As technology advances to giga-scale integration level, global interconnect resource becomes increasingly valuable in a VLSI chip. This is due to the exponential growth of the total number of interconnects/wires as the feature size of MOS transistors decreases in scaled deep submicron CMOS technologies. Interconnect length, however, has not scaled down with feature size and remains long relativ...