Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based ...

This review presents a brief overview of the health effects and exposures of two criteria pollutants--ozone and particulate matter--and two toxic air pollutants--benzene and formaldehyde. These pollutants were selected from the six criteria pollutants and from the 189 toxic air pollutants on the basis of their prevalence in the United States, their physicochemical behavior, and the magnitude of...

Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to 1100 “C. Based on substantial differences between bonded hydrophilic and hydrophobic Si wafer pairs in the changes of the interface energy with respect to temperature, secondary ion mass spectrometry (SIMS) and transmission electron microscopy (TEM), we suggest that h...

This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by the residual stresses in multiple layers. A switched-capacitor sensing circuit with a trimming mechanism is used to amplify the capacitive sign...

The objective of this work is to obtain in situ slurry fluid flow data during the chemical mechanical planarization CMP process. Slurry flow affects the material removal processes, the creation of defects, and consumable use during CMP, and therefore impacts the cost and quality of polishing. Wafer-scale flow visualization using seeded slurry was accomplished for a variable applied load 0.3–2.5...

Cloud manufacturing (CMfg) is a new-generation service-oriented networked manufacturing model that provides distributed users centralized managed manufacturing resources, ability, and services. CMfg is applied here to a semiconductor manufacturing factory. Benefits are classified into five aspects: cost savings, efficiency, additional data analysis capabilities, flexibility, and closer partner ...

Backside wafer planarization methods are discussed in GaAs substrates. First method uses an epoxy based polymer to fill 10 mils deep via structures while the second method demonstrates a solidly filled 3.5mils deep metal vias. The planarization step is accomplished with a lapping and polishing step which exposes the via connection to the frontside. As a result high definition photolithography i...

Wafer manufacturing Industries uses conventional controller, but in order to control the position in sub nanometer range conventional controller is not suitable, why because Tuning and augmenting the controller becomes difficult and expensive. So a robust controller is designed for wafer manufacturing system. The controller design in this paper is performed for the translational x and y DOFs in...