The thermal warpage of asymmetric laminates can be converted into mechanical work. However, is usually unwanted, and mitigated with compensatory tool designs. This paper investigates both concepts, focusing on monostability, bistability the transitional behaviour between two. Numerical experimental results showed that maximum achievable work goes through a local then minimum as laminate transit...

X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt lattice planes in Analog Devices AD9253 initially falls, but after 100 °C, rises again. The twist across wafer falls linearly with an increase temperature. At 200 varies approximat...

In this work, the influence of a modification and fillers on dimensional stability warpage semi-crystalline polypropylene compounds in screw-based Large Area Additive Manufacturing is investigated by material characterization experimental testing. Polypropylene modified blending an amorphous polyolefin-copolymer as well addition three different talc, glass fibers, hollow beads, resulting eight ...

The behaviour of fibre-reinforced composites greatly depends on their layup structures. Through a full-field optimization study based multiple parameters, this paper investigates how different properties change with the layup. aim was to maximize extension-twist coupling performance while ensuring adequate bending stiffness and low thermal warpage make laminate suitable for shape-adaptive helic...

Abstract A hybrid composite reinforced by aramid, glass and carbon fibers processed with integrated vacuum infusion is studied in this paper. Reasons why the suffers from warpage after post-curing are analyzed. Such deformation restrained adjusting thickness ratio of fibers. Results indicate that a constant areal density, minimum 0.28 when surface layer to back 1.46.

In the die design of high pressure casting (HPDC), in order to prevent from warpage, it is essential predict ejection force each ejector pin before locating it. Recently, Shiga et al. revealed that their developed elasto-plastic-creep model more accurate than conventional elasto-plastic models estimate thermal stress during cooling with constraint dies.