Small-angle neutron scattering ( SANS ) measurements were mainly carried out in order to investigate the structure change during early stage of phase decomposition in Fe-Cu-Ni-Mn quaternary alloy. The fact that the nuclear Guinier radius becomes larger than the magnetic one beyond about 2 nm is attributed to the formation of segregated layer enriched by Ni and Mn around fcc copper-rich precipit...

Fracture behavior of Cu-Ni laminate composites was investigated by tensile testing. It was found that as the individual layer thickness decreases from 100 to 20 nm, the resultant fracture angle of the Cu-Ni laminate changes from 72° to 50°. Cross-sectional observations reveal that the fracture of the Ni layers transforms from opening to shear mode while that of the Cu layers keeps shear mode. C...

Ni-based under-bump metallization (UBM) has attracted wide attention due to its low reaction rate with Sn, compared with Cu and Cu alloy. In this study, the interfacial reactions between eutectic Sn–3.5Ag solder and Ni-based UBM, including electroplated Ni (EP-Ni) and electroless Ni (EL-Ni) are investigated. Morphology and growth kinetics of Ni3Sn4 intermetallic compounds are studied at differe...

Acyclic pyrazine-2-carboxamide and thioether containing hexadentate ligand 1,4-bis[o-(pyrazine-2-carboxamidophenyl)]-1,4-dithiobutane (H(2)bpzctb), in its deprotonated form, has afforded light brown [Ni(II)(bpzctb)](1)(S=1) and green [Cu(II)(bpzctb)](2)(S=1/2) complexes. The crystal structures of 1.CH(3)OH and 2.CH(2)Cl(2) revealed that in these complexes the ligand coordinates in a hexadentate...

One-dimensional (1D) halide-bridged Cu(I)–Ni(II) heterometal coordination polymers containing a hexamethylene dithiocarbamate (Hm-dtc) ligand have been synthesized and crystallographically characterized. The highest occupied molecular orbital (HOMO) and lowest unoccupied molecular orbital (LUMO) levels of the coordination polymers were estimated using UV-Vis-NIR and photoelectron spectroscopies...

In this paper we report on the activity of Cuand Ni-containing cerium oxide catalysts for low-temperature water-gas shift (WGS). Bulk catalysts were prepared in nanocrystalline form by the urea co-precipitation–gelation method. Lanthanum dopant (10 at.%) was used as a structural stabilizer of ceria, while the content of Cu or Ni was in the range of 5–15 at.% (2–8 wt.%). At low metal loadings, C...

Layered copper-nickel cyanide, CuNi(CN)4, a 2-D negative thermal expansion material, is one of a series of copper(ii)-containing cyanides derived from Ni(CN)2. In CuNi(CN)4, unlike in Ni(CN)2, the cyanide groups are ordered generating square-planar Ni(CN)4 and Cu(NC)4 units. The adoption of square-planar geometry by Cu(ii) in an extended solid is very unusual.

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...