We apply the HotQC method of Kulkarni et al. (J Mech Phys Solids 56:1417–1449, 2008) to the study of quasistatic void growth in copper single crystals at finite temperature under triaxial expansion. The void is strained to 30% deformation at initial temperatures and nominal strain rates ranging from 150 to 600K and from 2.5×105 to 2.5×1011 s−1, respectively. The interatomic potential used in th...

The subject of this study is the modeling of the evolution of the swelling pressure of granulates with cohesive-frictional, rough and elasto-plastic “microscopic” contact properties. The spherical particles are randomly arranged in a periodic cubic space with a fixed volume so that an increase of the particle size – i.e. swelling that can be caused by intake of some fluid – is accompanied by a ...

1 Mines ParisTech, Centre des matériaux, CNRS UMR 7633, BP87 91003 Evry Cedex, France [email protected] Flat to slant crack transition can typically be observed in ductile thin sheet materials. The crack initiates perpendicularly to the loading direction from the notch and then turns to 45° with respect to the loading direction during crack propagation. This phenomenon is, how...

Electromigration is one of the most important reliability issues in semiconductor technology. Its complex character demands comprehensive physical modeling as basis for analysis. Simulation of electromigration induced interconnect failure focuses on the life-cycle of intrinsic voids, which consists of two distinct phases: void nucleation and void evolution. We present models for both phases as ...

Elastic anticavitation is the phenomenon of a void in an elastic solid collapsing on itself. Under the action of mechanical loading alone typical materials do not admit anticavitation. We study the possibility of anticavitation as a consequence of an imposed differential growth. Working in the geometry of a spherical shell, we seek radial growth functions which cause the shell to deform to a so...

Database support of time-varying phenomena typically assumes that entities change in a linear fashion. Many phenomena, however, change cyclically over time. Examples include monsoons, tides, and travel to the workplace. In such cases, entities may appear and disappear on a regular basis or their attributes or location may change with periodic regularity. This paper introduces an approach for mo...

We have developed a novel physical model and a simulation algorithm capable of predicting electromigration (EM) induced void nucleation and growth in an arbitrary interconnect segment. Incorporation of all imp ortant atom migration causes into the mass balance equation and its coupled solution with the corresponding electromagnetics, heat transfer and elasticity problems has provided a capabili...

The influence of inertial, thermal and rate sensitive effects on the void growth at high strain rate in a thermal viscoplastic solid is investigated by means of a theoretical model presented in the present paper. Numerical analysis of the model suggests that inertial, thermal and rate sensitive effects are three major factors which greatly influence the behavior of void growth in the high strai...

The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration and thermomigration, where void nucleation and growth contribute to the ultimate failure of the module. The Ni under bump metallization–solder joint interface ...