Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 199Os, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creating a void or seam, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievabl...

tio2 /fe3o4 nanocomposites with various tio2:fe3o4 ratios were synthesized by an ultrasonic-assisted deposition-precipitation method and their uv-light decolorization of congo dye and magnetic separation were investigated. the nanocomposite samples were characterized by scanning electron microscopy (sem), powder x-ray diffraction (xrd), surface area analayzer (bet) and fourier transform infrare...

Development of a green belt with suitable plant species around the source of emission can mitigate the atmospheric contamination. Selection of such plant species are required to combat air pollution based on their tolerance level. Present study was undertaken to evaluate the tolerance level of higher plants in East of Esfahan city, Iran, during 2011 in terms of assessing Air Pollution Tolerance...