نتایج جستجو برای: dibl effect

تعداد نتایج: 1641706  

2002
V. Ramgopal Rao J. Vasi

In this paper for the first time we report a study on the small signal characterization and simulation of Single Halo (SH) thin film SOI nMOSFETs. The single halo structure has a high pocket impurity concentration near the source end of the channel and low impurity concentration on the drain side. Besides having excellent dc output characteristics, better Vth – L roll-off control, low DIBL, hig...

2013
S. Krishna

The metal oxide semiconductor field effect transistor is the building block of VLSI(Very Large Scale Industry).Minimum featrure size of the ICs has shurnk consideably over the time of several decades. This results in a chip with the same functionality in a smaller area, or chips with more functionality in the same area.As a consequence,the number of transistor has increased over time. When gate...

2014
S. K. Mohapatra K. P. Pradhan P. K. Sahu

Influence of dielectric materials as gate oxide on various short channel device parameters using a 2-D device simulator has been studied in this paper. It is found that the use of high-k dielectrics directly on the silicon wafer would degrade the performance. This degradation is mainly due to the fringing field effect developed from gate to source/drain. This fringing field will further generat...

2016
Mehdi Saremi Ali Afzali-Kusha Saeed Mohammadi

In this paper, a fin-shaped field effect transistor (FinFET) structure which uses ground plane concept is proposed and theoretically investigated. The ground plane reduces the coupling of electric field between the source and drain reducing drain-induced barrier lowering (DIBL). To assess the performance of the proposed structure, some device characteristics of the structure have been compared ...

Journal: :Solid-state Electronics 2021

A comprehensive study of the scaling negative capacitance FinFET (NC-FinFET) is conducted with TCAD. We show that NC-FinFET can be scaled to "2.1nm node" and almost "1.5nm comes two nodes after industry "3nm node," which has 16nm Lg last node according International Roadmap for Devices Systems (IRDS). In addition, intervening nodes, meet IRDS Ion Ioff target at target-beating VDD. The benefits ...

Journal: :IEICE Transactions 2005
Kyeong-Sik Min Kouichi Kanda Hiroshi Kawaguchi Kenichi Inagaki Fayez Robert Saliba Hoon-Dae Choi Hyun-Young Choi Daejeong Kim Dong Myong Kim Takayasu Sakurai

A new Row-by-Row Dynamic Source-line Voltage control (RRDSV) scheme is proposed to reduce the active leakage as well as the stand-by leakage in SRAM. By dynamically controlling the source-line voltage of cells row by row, the cell leakage through inactive cells can be reduced by two orders of magnitude. Moreover, the bit-line leakage through pass transistors can be completely cut off. This leak...

2016
Amine AYED Mongi LAHIANI Hamadi GHARIANI

In this paper, the EKV3.0 model used for RF analog designs was validated in all-inversion regions under bias conditions and geometrical effects. A conversion of empirical data of 180nm CMOS process to EKV model was proposed. A MATLAB developed algorithm for parameter extraction was set up to evaluate the basic EKV model parameters. Respecting the substrate, and as long as the source and drain v...

2011
Deepesh Ranka Ashwani K. Rana Rakesh Kumar Yadav Devendra Giri K. Asano N. Lindert V. Subramanian M. Fujiwara T. Morooka N. Yasutake K. Ohuchi N. Aoki H. Tanimoto M. Kondo Ming-Wen Ma Chien-Hung Wu Tsung-Yu Yang Kuo-Hsing Kao Woei-Cherng Wu Shui-Jinn Wang Tien-Sheng Chao R. Tsuchiya K. Ohnishi M. Horiuchi S. Tsujikawa Y. Shimamoto N. Inada J. Yugami F. Ootsuka D. L. Kencke W. Chen H. Wang S. Mudanai Q. Ouyang A. Tasch S. K. Banerjee

As scaling down MOSFET devices degrade device performance in term of leakage current and short channel effects. To overcome the problem a newer device Silicon-on-Insulator (SOI) MOSFET has been introduced. The Fully Depleted (FD) SOI MOSFETs also suffer from short channel effects (SCE) in the sub 65 nm regime due to reduction in threshold voltage. Several investigations are going to reduce the ...

2010
VIJAYA KUMAR

Considerable challenges are encountered when bulk CMOS devices are scaled into the sub-100 nm regime for higher integrated circuit (IC) density and performance. Due to their excellent scalability and better immunity to short channel effects, double-gate (DG) MOSFETs are being easily assessed for CMOS applications beyond the 70 nm of the SIA roadmap. For channel lengths below 100 nm, DG MOSFETs ...

2003
Najeebuddin Hakim V. Ramgopal Rao J. Vasi

In this paper we report a study on the small signal characterization and simulation of Single Halo (SH) thin film Silicon-on-Insulators (SOI) nMOSFETs for analog and mixed signal applications. The single halo structure has a high pocket impurity concentration near the source end of the channel and low impurity concentration in the rest of the channel. Besides excellent DC output characteristics...

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