نتایج جستجو برای: fracture mode

تعداد نتایج: 315523  

ژورنال: مجله دندانپزشکی 2011
فیروزبخت, محمد مهدی, هدایتی, زهره,

Background and Aims: The aim of this study was to evaluate the effect of application of two types of primers over bracket bases on the shear bond strength (SBS) and mode of bond failure.Materials and Methods: In this study, 75 human premolar teeth were divided into three equal groups. In group 1 (control), after surface preparation of enamel by conventional method (acid etching+primer) brackets...

Journal: :International Journal of Solids and Structures 2013

The present paper deals with the mixed mode fracture analysis of a weakened orthotropic half-plane with multiple cracks propagation. The orthotropic half-plane contains Volterra type glide and climb edge dislocations. It is assumed that the medium is under in-plane loading conditions. The distributed dislocation technique is used to obtain integral equations for the dynamic problem of multiple ...

Journal: :Dental materials journal 2008
Suha Turkaslan Arzu Tezvergil-Mutluay Bora Bagis Akikazu Shinya Pekka K Vallittu Lippo V Lassila

This study evaluated the fracture load and failure mode of various veneer materials cemented with or without the addition of a fiber-reinforced composite (FRC) layer at the adhesive interface. Sixty intact incisors were randomly divided into three groups. Group 1 was fabricated with the heat-press technique (IPS Empress 2); Group 2 with the copy milling technique (ZirkonZahn); and Group 3 with ...

Journal: :Journal of dentistry 2005
Garry J P Fleming Lawrence Nolan Jonathan J Harris

OBJECTIVES To assess the effect of interfacial surface roughness on the flexure strength and fracture mode and origin utilizing an in-vitro assessment of the clinical failure conditions expected for all-ceramic crowns and the connector area of fixed partial dentures (FPDs) using bilayered ceramic specimens tested in bi-axial flexure. METHODS Sets of 20 bilayered composite discs, with core:den...

2012
Asli Baysal Tancan Uysal Nisa Gul Melike Busra Alan Sabri Ilhan Ramoglu

OBJECTIVE We evaluated the detachment force, amount of deformation, fracture mode, and pull-out force of 3 different wires used for bonded lingual retainer fabrication. METHODS We tested 0.0215-inch five-stranded wire (PentaOne, Masel; group I), 0.016 × 0.022-inch dead-soft eight-braided wire (Bond-A-Braid, Reliance; group II), and 0.0195-inch dead-soft coaxial wire (Respond, Ormco; group III...

Journal: :Adv. Model. and Simul. in Eng. Sciences 2016
Ralston Fernandes Sami El-Borgi Khaled Ahmed Michael I. Friswell Nidhal Jamia

This paper presents a methodology for conducting a 3-D static fracture analysis with applications to a gas turbine compressor blade. An open crack model is considered in the study and crack-tip driving parameters are estimated by using 3-D singular crack-tip elements in ANSYS . The static fracture analysis is verified with a special purpose fracture code (FRANC3D). Once the crack front is perfe...

Journal: :Philosophical transactions. Series A, Mathematical, physical, and engineering sciences 2012
Moustafa Kinawy Richard Butler Giles W Hunt

Buckling-driven delamination is considered among the most critical failure modes in composite laminates. This paper examines the propagation of delaminations in a beam under pure bending. A pre-developed analytical model to predict the critical buckling moment of a thin sub-laminate is extended to account for propagation prediction, using mixed-mode fracture analysis. Fractography analysis is p...

2014
BRADLEY C. ABELL LAURA J. PYRAK-NOLTE

Significant work in the past few decades has lead to a well developed understanding of seismic wave propagation in fractured media. However, previous research has focused on fractures within rock as opposed to fractures at the surface of a rock. A theoretical and experimental study was performed to examine seismic wave propagation along a fracture at the surface, i.e., along the intersection of...

2017
Murthy Kolluri

The demands by the semiconductors industry for high levels of integration, lower costs and a growing need for complete system solutions has led to the emergence of ”System In Package” (SIP) solutions in which ”the package is the system”. Since SIP-microsystems have multiple thin and stacked layers manufactured using different processes and materials, internal (intrinsic and/or thermal) mismatch...

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