نتایج جستجو برای: low aspect ratio

تعداد نتایج: 1689357  

2011
Matt Shields Kamran Mohseni

The growing interest in micro aerial vehicles has brought attention to the need for an improved understanding of the aerodynamics of low-aspect-ratio wings at lowReynolds numbers. In this study, flat plate wings with rectangular and tapered planforms were fabricated with aspect ratios of 0.75, 1, 1.5, and 3, and the aerodynamic loading was measured at Reynolds numbers between 5 10 and 1 10. Sur...

Journal: :International Symposium on Particle Image Velocimetry 2021

In recent decades, Micro Air Vehicles (MAVs) have been a hot topic for their promising future. But the promotions of MAVs are hindered by short endurances. To solve this problem, inspirations brought from migratory butterflies who utilize ‘flapping-gliding’ skill during long-distance migration to improve flight efficiency. The butterfly’s gliding flights, which can be simplified considering ste...

2005
H. Dong R. Mittal M. Bozkurttas

Most wings and fins found in nature tend to be of low or moderate aspect-ratio. However, most experimental and numerical studies in this area of bio-hydrodynamics have focused on examining large or infinite aspect-ratio flapping foils. In the current study, an efficient, finite-difference based immersed boundary solver for computing flows with moving immersed boundaries has been developed to ex...

Journal: :journal of nanostructures 2012
n. hajialigol g. a. sheikhzadeh m. ebrahim qomi a. fattahi

the fluid flow and heat transfer in lid-driven enclosures filled with cu-water nanofluid is numerically investigated. the moving vertical walls of the enclosure  are maintained in a constant temperature, while the horizontal walls are insulated. the hybrid scheme is used to discretize the convection terms and simpler algorithm is adopted to couple the velocity field and pressure in the momentum...

2006
Pradeep Dixit Jianmin Miao

Copper electrodeposition in high-aspect-ratio through-holes micromachined by deep reactive ion etching is one of the most essential processes for fabricating through-wafer interconnects, which will be used in developing future generation high-speed, compact 3D microelectronic devices. Although copper electrodeposition is a well-established process, completely void-free electroplating in very de...

Journal: :The Journal of the Japan Society of Aeronautical Engineering 1957

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