This study proposes the use of symmetrical ogive-shaped ribs on walls microchannel heat sinks (MCHS) to improve their thermal performance with minimal pressure drop. The are arranged in three different configurations: attached all channel (MC-SAWR), side (MC-SSWR), and bottom wall (MC-SBWR). Numerical investigations conducted using laminar conjugate transfer model flow characteristics MCHS. aug...

The optimum design of the microchannel heat sinks needs to consider both transfer and pressure drop limitations microchannel. In this paper, a novel configuration sink is proposed obtain improved thermo-hydraulic performance. includes porous fins that form adjacent converging–diverging channels. Three-dimensional steady laminar simulations were conducted access performance compare it with conve...

The study of the influence nanoparticle volume fraction and aspect ratio microchannels on fluid flow heat transfer characteristics nanofluids in is important optimal design dissipation systems with high flux. In this work, computational dynamics method was adopted to simulate two types water-Al2O3 different fractions five microchannel sinks ratios. Results showed that increasing reduced average...

Thermal management at a high heat flux is crucial for high-power electronic devices, and jet impingement cooling promising solution. In this paper, hybrid sink combining microchannel was designed, fabricated tested in closed-loop system with R134a as the working fluid. The thermal contact resistance measured by using steady-state method, of obtained different fluxes flow rates. maximum dissipat...

The microchannel heat sink (MCHS) has become the most relevant micro-heat exchanger for a small area in need of an effective high removal system. However, dissipation from microchips where MCHS is utilized—the microprocessor and microcontroller—is getting higher with sizes smaller. A more coolant needed to address increasing load microchip nanofluid, nanosized particles dispersed base fluid, am...

Increasing the power and reliability of microelectronic components requires heat sinks with greater transport performance. This study investigates hydraulic performance a silicon sink under constant flux 100 W/cm2 liquid coolant running through parallel microchannels. The coupled transfer walls coolant, modelled as single-phase fluid, is examined over Reynolds number range 100?Re?350 for micro-...

The transient hydrodynamics and thermal behaviors of fluid flow in open-ended vertical parallel-plate porous microchannel are investigated semi-analytically under the effect of the hyperbolic heat conduction model. The model that combines both the continuum approach and the possibility of slip at the boundary is adopted in the study. The Effects of Knudsen number , Darcy number , and thermal re...