نتایج جستجو برای: ni3al intermetallic

تعداد نتایج: 4021  

2017
Ji Liu Xiaofeng Fan Chang Q Sun Weiguang Zhu

Detailed density functional theory (DFT) calculations of the adsorption energies (Ead) for oxygen on monolayer Pd on top of the Pd-Cu face-centered cubic (FCC) alloy and intermetallic B2 structure revealed a linear correspondence between the adsorption energies and the d-band center position. The calculated barrier (Ebarrier) for oxygen dissociation depends linearly on the reaction energy diffe...

2004
N. S. Bosco F. W. Zok

The study focuses on the critical interlayer thickness for averting pore formation during transient liquid phase (TLP) bonding in the Cu–Sn system. Such pores are a consequence of the growth and subsequent contact of Cu6Sn5 intermetallic grains on the two surfaces to be bonded, prior to the formation of the transient liquid phase. A criterion for the critical interlayer thickness is developed, ...

2017
Keith J. Dusoe Sriram Vijayan Thomas R. Bissell Jie Chen Jack E. Morley Leopolodo Valencia Avinash M. Dongare Mark Aindow Seok-Woo Lee

Bulk metallic glasses (BMGs) and nanocrystalline metals (NMs) have been extensively investigated due to their superior strengths and elastic limits. Despite these excellent mechanical properties, low ductility at room temperature and poor microstructural stability at elevated temperatures often limit their practical applications. Thus, there is a need for a metallic material system that can ove...

2016
Chunyan Song Shuhuan Wang Yongliang Gui Zihao Cheng Guolong Ni

Intermetallic compounds are increasingly being expected to be utilized in tribological environments, but to date their implementation is hindered by insufficient ductility at low and medium temperatures. This paper presents a novel multiphase intermetallic alloy with the chemical composition of Mo-40Ni-13Si (at %). Microstructure characterization reveals that a certain amount of ductile Mo phas...

Journal: :iranian journal of materials forming 2014
s.mohammad hossein mirbagheri mohammad javad khajehali

abstractin this paper, we investigate effect of fe–intermetallic compounds on plastic deformation of closed-cell composite aluminum foam as filler of thin-walled tubes. however, deformation of the aluminum foam-filled thin-walled tubes as crushed-box will be presented in part (ii). composite foams of alsi7sic3 and alsi7sic3-(fe) as closed cell were synthesized by powder metallurgy foaming metho...

2016
A. Morton

The past two decades have seen alloys based upon intermetallic phases evolve from the status of scientifically interesting materials with a range of attractive properties, combined with overriding disadvantages, to that of the next generation of advanced engineering alloys. This evolution, which has been achieved through a very significant research and development effort on a world wide front, ...

Journal: :Inorganic chemistry 2007
Gabriel Canard Claude Piguet

The thermodynamics of electrochemical and complexation reactions involving the heterobimetallic triple-stranded helicates [MA(L5)3]n+ (M=Ru(II), Cr(III) and A=Ca(II), Lu(III)) reveal that solvation processes mask intramolecular intermetallic repulsions in solution, a phenomenon at the origin of the surprising stabilities of highly charged self-assembled polymetallic complexes in solution. A jud...

M. Salehi,

In this research, tribological behavior of Ti-Ni-P intermetallic coatings on titanium substrates have been investigated under dry reciprocating conditions. Hardness profile testing results exhibit that high surface hardness has been attained and static indentation result shows that the intermetallic coating has better adhesion strength than the conventional ceramic coatings. In this respect, th...

Journal: :international journal of advanced design and manufacturing technology 0
amin amani sadegh rahmati

the aim of this project is to fabricated an aluminium-copper bimetal through the fusion method and examine its performance. an aluminium-copper-aluminium bimetal was built by the laser cladding method. the laser power as well as the annealing time effects on its interfacial properties of the bonding’s formed through the laser cladding were investigated. to fabricate the multilayer bimetal, the ...

Journal: :Microelectronics Reliability 2009
Brook Huang-Lin Chao Xuefeng Zhang Seung-Hyun Chae Paul S. Ho

A comprehensive kinetic analysis was established to investigate the electromigration (EM) enhanced intermetallic compound (IMC) growth and void formation for Sn-based Pb-free solder joints with Cu under bump metallization (UBM). The kinetic model takes into account Cu–Sn interdiffusion and current stressing. Derivation of the diffusion coefficients and the effective charge numbers for the inter...

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