نتایج جستجو برای: soldering

تعداد نتایج: 2525  

Journal: :Nanotechnology 2013
K D M Rao B Radha K C Smith T S Fisher G U Kulkarni

We report a simple lithography-free, solution-based method of soldering of carbon nanotubes with Ohmic contacts, by taking specific examples of multi-walled carbon nanotubes (MWNTs). This is achieved by self-assembling a monolayer of soldering precursor, Pd(2+) anchored to 1,10 decanedithiol, onto which MWNTs could be aligned across the gap electrodes via solvent evaporation. The nanosoldering ...

2004
Wallace Rubin Malcolm Warwick

The use of no-clean fluxes in liquid and solid form has grown considerably primarily for two reasons: to reduce costs and to minimize the environmental impact of soldering operations. At the same time, considerable work is progressing on no-clean fluxes for solder pastes. In order to build confidence in the technology, it is essential to prove that no-clean fluxes can produce good soldering per...

2012

The main aim of this work was to determine the soldering, thermal and mechanical properties of joints fabricated by use of Au-20Sn solder. Soldered joints were fabricated by application of a flux-free process with assistance of power ultrasound. By acting of power ultrasound, the Au-20Sn solder wets the surface of Cu, Ag and Ni substrates. The contact wetting angle on all substrates varied with...

2012
A. Larsson F. Oldervoll T. A. T. Seip H. Kristiansen

Anisotropic conductive film (ACF) has been used for flip chip interconnection of a silicon based MEMS finger print sensor to a signal processing ASIC. The assembled sensor device was subjected to a short term high temperature profile with peak temperature 260 C simulating subsequent reflow soldering of the device, and to thermal shock cycling from -40 to +85 C. The reliability of interconnect...

2015
T Maeder C Jacq M Blot

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive metallisation steps for both the ball and the cantilever, and subjects the solder pads used for mounting the cantilever to an additional reflow ...

2007
Satoshi Mizuta

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable ...

2008
Gilgueng Hwang

In this paper three-dimensional (3-D) suspended helical nanobelts (HNBs) with ultra-high flexibility are assembled by the external field guidance. Electromagnetic (EM) and electrostatic (ES) force by external potential are characterized quantitatively to guide the assembly of HNBs to create force sensing probe. Both ends of HNBs and target electrodes are attached with ferromagnetic metal connec...

Journal: :Journal of the Metal Finishing Society of Japan 1987

Journal: :Journal of Electronic Packaging 1990

Journal: :Scientific American 1889

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