statement of the problem: self-etch adhesives can activate matrix metalloproteinase (mmp) which hydrolyzes organic matrix of demineralized dentin. epigallocatechin gallate (egcg), especially found in green tea, could inhibit the activation of mmp. purpose: the aim of this study was to evaluate the effect of adding epigallocatechin gallate (egcg) into two types of adhesives on dentin bond streng...

Polysilicon thick films have been found to be an irreplaceable option in various sensors and other microelectromechanical system (MEMS)-designs. Polysilicon is also a prospective option for replacing singlecrystal silicon in customized silicon-on-insulator-substrates. Due to the nature of polysilicon, bonding for MEMS-purposes has so far concentrated on anodic bonding, which has drawbacks for i...

Carbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16H35)2, to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintainin...

We have determined the crystal structure of ammonium carbonate monohydrate, (NH4)2CO3·H2O, using Laue single-crystal diffraction methods with pulsed neutron radiation. The crystal is orthorhombic, space group Pnma (Z = 4), with unit-cell dimensions a = 12.047 (3), b = 4.453 (1), c = 11.023 (3) Å and V = 591.3 (3) Å(3) [ρcalc = 1281.8 (7) kg m(-3)] at 10 K. The single-crystal data collected at 1...

Based on the oxidation-free fluxless bonding technology, we have developed a bonding process to manufacture In–Au joints on copper substrates. 4 mm 4 mm Si blank dice and 6 mm 6 mm copper substrates are used. The dice are deposited with indium-rich Au/In/Cr multilayer structure in a single high vacuum cycle to prevent oxidation. Right after deposition, the outer Au layer interacts with the In l...

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This paper deals with a method for low cost power electronic substratescreation, which are used for power electronic devices. Direct bond copper (DBC) technology is suitable for creating substrates with excellent thermal and electrical conductivity and good mechanical properties. Furthermore, DBC allows to create copper layers with the thickness of hundreds micrometers in one processing step. I...

After carefully molding a beautiful product, nothing is worse than seeing it destroyed during assembly. Every joining process is capable of causing marking, flash, particulate, damage to appendages, or other aesthetic defects. However, with proper part design and processing, a finished weld can be imperceptible or even a cosmetic asset. The art to attractive bonding is specific to each process ...

This paper presents a rapid, ultra-low-cost approach to fabricate microfluidic devices using a polyolefin shrink film and a digital craft cutter. The shrinking process (with a 95% reduction in area) results in relatively uniform and consistent microfluidic channels with smooth surfaces, vertical sidewalls, and high aspect ratio channels with lateral resolutions well beyond the tool used to cut ...