This paper discusses the design for reliability of a sintered silver structure in a power electronic module based on the computational approach that composed of high fidelity analysis, reduced order modelling, numerical risk analysis, and optimisation. The methodology was demonstrated on sintered silver interconnect sandwiched between silicon carbide chip and copper substrate in a power electro...

The continuous rise in performance requirements of highend computers and networks has resulted in a rise in demand for high pin count and more sophisticated thermal solutions. Flip chip technology naturally presents a good option in offering I/Os of more than 500. With the addition of a heat spreader (of either one-piece or two-piece lid), the thermal performance of the package can be improved ...

Woven fabrics prove to be a very convenient fibre reinforcement when prepreg layers have to be draped on to double curvature moulds. The process of draping causes the angle between the warp and weft yarns to vary over the product with this double curvature. As a result, the thermomechanical properties of the fibre reinforced composite material show a corresponding distribution. These thermo-ela...

Abstract In this study, we present a novel approach for the production of continuous fiber-reinforced thermoplastic composites by combining injection molding and additive manufacturing. After exploring design requirements, manufactured inserts via 3D printing, then used them as reinforcement injection-molded samples. Improper fiber placement can cause warpage fibers prevent shrinking; however, ...