This study outlines the quantitation and characterization of element oxide nanoparticles (Al2O3, and CeO2) commonly used in the nanoelectronics and semiconductor fabrication industry for the chemical-mechanical planarization (CMP) of semiconductor surfaces. CMP is a process of smoothing surfaces with the combination of chemical and mechanical forces in preparation for photolithography. The proc...

A rapid and simple HPLC method has been developed for the determination of 4-chloro-3-methylphenol (CMP) in the metal working fluid (MWF), Trim VX and in experiments designed to measure the dermal penetration of CMP from MWF. The method used 2-methyl-4,6-dinitrophenol as an internal standard (IS). Water was used as the extraction solvent. The retention times of CMP and internal standard (IS) we...

this paper is an attempt to numerical modeling and experimental study of air flow in the yazdi wind-towers. wind towers has been known as one of the most effective climatic elements in iranian traditional architecture. this paper is an attempt to evaluating yazdi wind-tower to discussion the two main questions: 1. what is the role of orientation of wind-towers span, regarding to climate and hei...

Abstract As the minimum feature size of integrated circuit elements has shrunk below 7 nm, chemical mechanical planarization (CMP) technology grown by leaps and bounds over past several decades. There been a growing interest in understanding fundamental science CMP, which continued to lag behind advances technology. This review paper provides comprehensive overview various phenomena such as con...

The Chemical Mechanical Polishing (CMP) process is now widely employed in the manufacture of Ultra-Large-Scale Integrated (ULSI) circuits. Yet, the effects of various process parameters on the material removal rate (MRR) and the resulting surface topography are not well understood. In this chapter, accordingly, several polishing models are reviewed with emphasis on the mechanical aspects of CMP...

Chemical mechanical polishing (CMP) is widely used for pla-narization of advanced interconnect and shallow trench isolation structures in integrated circuit manufacture. Of particular concern is within-die variation in the interlevel dielectric or oxide thickness remaining after polish, due to pattern density variations across the die. 1 Recent modeling of CMP has shown that a " planarization l...

This study develops a model to assess the consumer acceptance of Camera Mobile Phone (CMP) technology for social interaction. While there has been considerable research on technology adoption in the workplace, far fewer studies have been done to understand the motives of technology acceptance for social use. To fill in this gap, this study develops a model that is based on the following theorie...