This paper describes the interaction of the NEMI recommended lead-free solder for reflow assembly (Sn3.8Ag0.7Cu) with different commercial printed wiring board (PWB) platings. It also discusses the effects of plating type and manufacturer on the strength of the lead-free solder joints. PWBs from two different manufacturers with the same four types of plating were examined. The platings were org...

An Adsorbent based treatment system is presented for toxic metal removal from rinsewater streams. The adsorbent is a Mg-A1 oxide anion exchange material with high capacity (approaching 5.5 meq/g) and strong selectivity for difficult to treat species such as Electroless plating metal chelates, Fixed Cyanides and chrome conversion solutions. Data is presented describing treatment of various metal...

The electroless coating technique is one of the elegant methods available for the production of protective coatings on surface. Our study has been aimed at the conditions of the electroless deposition of copper coating onto the iron powder particles from sulphate electrolyte. The course of the electroless process depends on the composition and pH of the electrolyte as well as on the size and co...

lectroless nickel plating is a relaE. hvely new technological process. The first laboratory experiments were done in 1944 by A. Brenner and G. Riddelll during World War 11. Public announcements were made a few years later. This work bad been done without knowledge of the earlier observations by Roux in 1916* and by Wurtz3 in 1845. The early work was not successful due to poor quality reagents a...

We present an integrated chemical sensor array fabricated using a CMOS process followed by post-processing. The sensor presented in this paper incorporates 324 individually addressable sensing nodes. Post processing involves an electroless Nickel and Gold plating step to fabricate sensing contacts, and the deposition of a carbon black based polymer sensor material. The operation of the integrat...

This thesis presents the low cost process for UBM formation on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallization) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between the bonding pads of the die and the bumps. Typically, UBM is deposited on the whole wafers by spu...