Bisphenol A or BPA-based epoxy resins are widely used in the manufacture of commercial products, including dental resins, polycarbonate plastics, and the inner coating of food cans. BPA is a precursor to the resin monomer Bis-GMA. During the manufacturing process of Bis-GMA dental sealants, Bisphenol A (BPA) might be present as an impurity or as a degradation product of Bis-DMA through esterase...

Due to their positive technical properties, such as high chemical resistance and mechanical durability, epoxy resins are moving into more and more deployment areas. Significant applications in the construction industry are coatings for industrial flooring, concrete restoration, corrosion proofing, adhesives for tiles, and joint mortar. Unfortunately, the growing use of these products is also co...

A lignocellulose-to-chemicals valorization chain is presented, wherein lignin oligomers obtained from reductive catalytic fractionation are used to synthesize BPA-free epoxy resins.

The molecular mobility related to the glass transition and secondary relaxations in a hyperbranched polyethyleneimine, HBPEI, and its relaxation behaviour when incorporated into an epoxy resin matrix are investigated by dielectric relaxation spectroscopy (DRS) and dynamic mechanical analysis (DMA). Three systems are analysed: HBPEI, epoxy and an epoxy/HBPEI mixture, denoted ELP. The DRS behavio...

Over a billion microwave ovens are used every day thus witnessing the importance of microwave heating in the world today. Microwave processing of polymers is a comparatively recent and vastly expanding field in industry due to economical advantages through energy saving and accelerated manufacture. Factors that hinder the use of microwaves in materials processing are decreasing every day. Epoxy...

In this study, we used diglycidyl ether bisphenol A (DGEBA) as a matrix, the ABA block copolymer poly(ethylene oxide-b-propylene oxide-b-ethylene oxide) (Pluronic F127) as an additive, and diphenyl diaminosulfone (DDS) as a curing agent to prepare flexible epoxy resins through reaction-induced microphase separation (RIMPS). Fourier transform infrared spectroscopy confirmed the existence of hydr...

Adhesion is important in many industrial applications including those in the microelectronics industry. Flip-chip assemblies commonly utilize epoxy underfills to promote reliability and the buried interfacial structure of underfills is crucial to device lifetime. Poor adhesion at this interface can cause premature device failure. One method to increase adhesion strength is to plasma treat the s...