0167-9317/$ see front matter 2010 Elsevier B.V. A doi:10.1016/j.mee.2010.08.001 ⇑ Corresponding author. E-mail address: [email protected] (J. Kanick We report on the effects of back channel etch depth and etchant chemistry on the electrical characteristics of inverted staggered advanced amorphous silicon thin-film transistors. We found that the optimum amorphous silicon film thickness in t...

The aim of this study was to compare the bond strength of translucent fiber posts to root dentin, cemented with 4 adhesion strategies. Forty eight (48) sound human central incisors were decoronated and divided into 4 groups: Etch-and-rinse group, two-step self-etch group, one-step self-etch group, and self-adhesive resin cement group. The adhesion between the post and root canal walls was asses...

A quantitative model capturing pattern dependent effects and time evolution of the etch rate in Deep Reactive Ion Etching (DRIE) is presented. DRIE is a key process for pattern formation in semiconductor fabrication. Non-uniformities are caused due to microloading and aspect ratio dependencies. The etch rate varies over time and lateral etch consumes some of the etching species. This thesis con...

Aim: To assess the influence of two adhesive systems on the bond strength of the restorative material to enamel and dentin after bleaching. Materials and method: 60 non-carious extracted premolar teeth after bleaching with 40% Hydrogen peroxide were divided into four groups based on type of adhesive system used and the tooth surface i.e. enamel and dentin used for bonding. G1ET and G3DT were re...

immediate restoration after vital pulp therapy is essential in order to create and maintain effective coronal seal.the aim of this study was to evaluate the shear bond strength of recently used pulp capping materials: white mineral trioxide aggregate (mta), and calcium enriched mixture cement (cem) to composite resin with the use of etch-and-rinse and self-etch adhesive systems and compare them...

The chemical dry etching of silicon nitride (Si3N4)and silicon nitride (SiO2) in a downstream plasma reactor using CF4, O2, and N2 has been investigated. A comparison of the Si3N4 and SiO2 etch rates with that of polycrystalline silicon shows that the etch rates of Si3N4 and SiO2 are not limited by the amount of fluorine arriving on the surface only. Adding N2 in small amounts to a CF4 /O2 micr...

OBJECTIVE To evaluate the ability of the resin-coat technique used in cavity preparation to protect dentin before impression taking and final cementation and its effect on the tensile bond strength of indirect restorations after thermal and load cycling. METHODS Occlusal enamel was removed from 25 third molars to expose flat dentin. Teeth were divided into 5 groups (n=5): G1, receiving no den...

With the arrival of self-etch adhesives systems, there has been a rise in interest among clinicians, making it imperative for health professionals to have knowledge of the properties, characteristics, the association as well as the dental structures of these materials, in order to select them and use them correctly. The self-etch adhesive systems show good values of bond strength, microleakage ...

Background: Restoring bonding composite to silver diamine fluoride (SDF)-treated enamel is challenging. This study investigates if phosphoric acid etch restores bond strength SDF-treated using universal adhesives. Methods: Twenty-four recently extracted permanent teeth were randomly divided into 4 (2 experimental (SDF) and 2 control (CTR)) groups: SDF+Water: SDF (1 min) then water rinse (15 mL)...

The water content of phosphoric acid in etching silicon nitride and silicon dioxide plays an important role. An increase in water content increases the etch rate of silicon nitride and decreases the etch rate of silicon dioxide. The highest possible temperature for a fixed water content at atmospheric pressure in the system H2O-P2O5 is realized by boiling the liquid and refluxing the vapor phas...