The purpose of this paper is to evaluate the weight values of key factors in a manager’s leadership skills that affect job performance in the listed IC Design Houses in Taiwan. The research subjects are three of the typically listed IC design houses in Taiwan. This paper adopts Analytic Network Process (ANP) to analyze the relevance of each criterion, and to identify the important factors of ea...

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to ...

In the past few years, several tools for the automation of the analog integrated circuit (IC) cell and system layout design, with application on both new and reused designs have emerged. Yet, most of the layout design is still handmade, essentially because analog designers want to have total control over the different design options, and also, due to the fact that current fully automated genera...

The application of the sliding-mode control theory to the regulation of dc-to-dc switching converters is reviewed. Subsequently, linear dynamical models are derived and compensating networks are designed. An analog integrated circuit illustrating the theory has been designed, implemented and applied to regulate a buck converter in continuous conduction mode. Experimental verifications are provi...

Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF applications. An approach to fast three-dimensional (3-D) modeling of the geometry for bonding wires in RF circuits and packages is demonstrated. The geometry can readily be used to extract electrical parameters such as inductance and capacitance. An equivalent circuit is presented to model the freq...

Since the invention of the integrated circuit technologies, there has been an unprecedented growth of the electronic industry, with significant impact on the maritime industry. In the last twenty years and so, the strongest growth area of the electronic industry has been in CMOS VLSI technology. The sustained growth in CMOS VLSI technology is fueled by a continued shrinking of transistors to ev...

Developing virtual performanceand reliability predictive techniques has become essential for the development of (micro)electronic systems. This paper provides an overview of current predictive methodologies, challenges and requirements for the modeling of microelectronics thermal behavior. Critical modeling issues are discussed, from optimizing Integrated Circuit (IC) packaging thermal performa...

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Backside via self-inductance is a critical electrical quantity needed for the design of Monolithic Millimeter-wave Integrated Circuits (MMIC). We have investigated a simple, analytical method for accurately calculating via inductance based upon physical geometry. The analytical method enables backside via process development to be tailored to meet design goals. Conversely, the sensitivity of RF...

The worldwide diffusion of wireless telecommunication systems opened new perspectives for microwave technologies. High-volume microwave monolithic integrated circuit (MMIC) production became a reality, revolutionizing the approach to microwave-circuit design. Nowadays, this is based on the intensive use of accurate simulation and computer-aided-design (CAD) tools. While scattering parameter mea...