Trapped magnetic flux is known to degrade the quality factor of superconducting cavities by increasing the surface losses ascribed to the residual resistance. In Nb3Sn cavities, which consist of a thin layer of Nb3Sn coated on a bulk niobium substrate, the bimetallic interface results in a thermal current being generated in the presence of a thermal gradient, which will in turn generate flux th...

This article reviews recent numerical studies of thermal transport in graphene, with a focus on molecular dynamics simulation, the atomistic Green’s function method, and the phonon Boltzmann transport equation method. The mode-wise phonon contribution to the intrinsic thermal conductivity (κ) of graphene and the effects of extrinsic mechanisms—for example, substrate, isotope, impurities, and de...

Interfaces dominate the thermal resistances in aligned carbon nanotube arrays. This work uses nanosecond thermoreflectance thermometry to separate interface and volume resistances for 10 microm thick aligned SWNT films coated with Al, Ti, Pd, Pt, and Ni. We interpret the data by defining the nanotube-metal engagement factor, which governs the interface resistance and is extracted using the meas...

Contact Thermal Resistance In article number 2214071, Kai Wu, Qiang Fu, and co-workers report a joint-inspired interfacial engineering strategy by employing liquid metal to the surface of rigid alumina, which improves material's thermal conductivity thixotropy. This method will inspire development high-performance polymer-based interface materials for future advanced electronics.

Thermal contact resistance between two adjacent materials is one of the major concerns in a large variety practical situations heat transfer. The presence this yields temperature jump across interface. Due to discontinuity, numerical modelling thermal runs into difficulties. In work, we propose simple and efficient model account for at immersed interfaces multi-material present based on diffuse...

In this paper, three-dimensional finite element analysis using the commercial ANSYS software is performed to study the thermal performance of a thermally enhanced FC-PBGA (flip-chip plastic ball grid array) assembly in both natural and forced convection environments. The thermally enhanced FC-PBGA assembly is a basic FC-PBGA assembly with a lid attached on top, after which an extruded-fin heats...