The P1149.4 mixed-signal boundary scan standard is demonstrated with a CMOS integrated circuit. Design issues and characterization data are presented.

The lithography process is the critical step in the fabrication of nanostructures for integrated circuit manufacturing. It accounts for one third of the costs of manufacturing integrated circuits. The rapid transition to smaller microelectronic feature sizes involves the introduction of new lithography technologies, new photoresist materials, and tighter processes specifications. This transitio...

Many auditory theorists consider the temporal adaptation of the auditory nerve a key aspect of speech coding in the auditory periphery. Experiments with models of auditory localization and pitch perception also suggest temporal adaptation is an important element of practical auditory processing. I have designed, fabricated, and successfully tested an analog integrated circuit that models many a...

The end of the 19 century brought about a change in the dynamics of computing by the development of the microprocessor. Huge bedroom size computers began being replaced by portable, smaller sized desktops. Today the world is dominated by silicon, which has circumscribed chip development for computers through microprocessors. Majority of the integrated circuits that are manufactured at present a...

New developments and results in the area of process simulation are reviewed. These results have increased significantly our understanding of the underlying processes that govern integrated circuit (IC) fabrication techniques,

The short and long term reliability of National Semiconductor’s interface circuits, like any integrated circuit, is very dependent on its environmental condition. Beyond the mechanical/environmental factors, nothing has a greater influence on this reliability than the electrical and thermal stress seen by the integrated circuit. Both of these stress issues are specifically addressed on every in...

− There’re mainly two different situations for testing PLD (Programmable Logic Device) devices. One is testing of blank chips that haven’t been programmed; the other is testing of ASIC (Application Specific Integrated Circuit) devices that have been programmed. This paper presents a test method for programmed ASIC devices, including auto test and ATPG (Auto Test Pattern Generation) method for b...

Taiwan’s integrated circuit (IC) industry development process can be separated into three stages: the initiation stage, consisting of obtaining technology and facilitating setup of domestic companies; the burgeoning stage, consisting of the formation of manufacturer’s R&D abilities; and the growth stage, consisting of further raising an industry’s international competitive levels. In each stage...