The idea of extending cavity quantum electrodynamics experiments to sub-wavelength sized nanomechanical systems has been recently proposed in the context of optical cavity cooling and optomechanics of deformable cavities. Here we present an experiment involving a single nanorod consisting of about 10(9) atoms precisely positioned into the confined mode of a miniature high finesse Fabry-Pérot mi...

CuInS2 quantum dots (QDs) were deposited onto TiO2 nanorod arrays for different cycles by using successive ionic layer adsorption and reaction (SILAR) method. The effect of SILAR cycles on the light absorption and photoelectrochemical properties of the sensitized photoelectrodes was studied. With optimization of CuInS2 SILAR cycles and introduction of In2S3 buffer layer, quantum dot-sensitized ...

Classical molecular dynamics simulation is used for structural thermodynamic and dynamic analysis of Au-Pd bimetallic clusters. It is observed that the Pd-core/Au-shell structure is the most stable, and can be formed through annealing of other structures such as Au-core/Pd-shell, eutecticlike, or solid solution. Depending on the starting temperature and initial composition, three-layer icosahed...

We demonstrate a method to assemble gold nanorods highly deterministically into a chain formation by means of directed capillary assembly. This way we achieved straight chains consisting of end-to-end aligned gold nanorods assembled in one specific direction with well-controlled gaps of ∼6 nm between the individual constituents. We determined the conditions for optimum quality and yield of nano...

Introducing a hydrophobic property to vertically aligned hydrophilic metallic nanorods was investigated experimentally and theoretically. First, platinum nanorod arrays were deposited on flat silicon substrates using a sputter Glancing Angle Deposition Technique (GLAD). Then a thin layer of Teflon (nanopatches) was partially deposited on the tips of platinum nanorod at a glancing angle of θ = 8...

Wafer bonding is an emerging technology for fabrication of complex three-dimensional (3D) structures; particularly it enables monolithic wafer-level 3D integration of high performance, multi-function microelectronic systems. For such a 3D integrated circuits, lowtemperature wafer bonding is required to be compatible with the back-end-of-the-line processing conditions. Recently our investigation...

A method is described for assembling gold nanorods into one-, two-, and three-dimensional superstructures. The addition of dimercaptosuccinic acid (DMSA) into the nanorod solution was found to induce self-assembly of the latter to one-dimensional "tapelike", two-dimensional "sheetlike" and three-dimensional "superlattice-like" structures depending on the DMSA concentration. The assembly was fou...

Three-dimensional (3D) ZnO–CuO core-shell nanorod arrays have been synthesized by a three-step process on silicon (100) substrates. A hydrothermal method was used to grow 3D ZnO nanorod arrays, followed by deposition of Cu nanofilm using sputtering, which was oxidized subsequently at 400 C to form CuO shell surrounding ZnO nanorod core. The control over oxygen flow and pressure during the Cu na...

Future one-dimensional electronics require single-crystalline semiconductor free-standing nanorods grown with uniform electrical properties. However, this is currently unrealistic as each crystallographic plane of a nanorod grows at unique incorporation rates of environmental dopants, which forms axial and lateral growth sectors with different carrier concentrations. Here we propose a series of...