The ion sputtering process for the deposition of coatings from alternating layers light and heavy metals are considered, taking into account mutual mass transfer target to substrate as result resputtering coating matter by reflected fast neutral gas atoms (former primary bombarding ions, backscattered towards substrate). effect is more important in case a metal Ta type on layer Si since it form...

Introduction: Several mechanisms have been identified to result in escape of the Martian atmosphere. These mechanisms can be divided in two groups [1]: • Thermal escape or Jeans escape, which corresponds to the loss of atoms in the high energy tail of the energy distribution at the exobase. This mechanism is important only for the light species such as hydrogen or deuterium. • Non-thermal escap...

Three-dimensional molecular dynamics simulations of hyperthermal copper atom impacts with copper surfaces have been used to investigate the effects of incident atom energy upon atomic reflection and resputtering during physical vapor deposition. No reflection or resputtering has been observed for incident energies below 10 eV. However, as the incident energy was increased to 20 eV and above, th...

In magnetron sputtering, only a fraction of the sputtered target material leaving ionization region is directed toward substrate. This may be different for ions and neutrals as can exhibit spread they travel from surface difference significant in high power impulse sputtering (HiPIMS) where substantial known to ionized. Geometrical factors or transport parameters that account loss produced film...

Potential sputtering erosion caused by the interactions between spacecraft and plasma plume of Hall thrusters is a concern for electric propulsion. In this study, calculation model of Hall thruster’s plume and sputtering erosion is presented. The model is based on three dimensional hybrid particle-in-cell and direct simulation Monte Carlo method PIC/DSMC method which is integrated with plume-wa...

The results of a study the long-term reproducibility emission characteristics electron sources with field density up to 1000 A/cm 2 based on composite nanocarbon films are presented. It was found that high-current is accompanied by sputtering residual gas ions from atoms cathode material and its sedimentation anode. can be used predict durability diamond-graphite cathodes when operating in unst...

We study the variation of sputtering yields with surface morphologies under the assumption of a specially prescribed surface shape. Compared with a flat surface, we show that surface morphology can cause a decrease in the sputtering yield and an increase in the incident angle where sputtering yield is maximum. Based on Sigmund’s theory, an analytical formula for the morphology dependent sputter...

The flow of energy from the impact site of a heavy, translationally energetic xenon atom on an ice surface leads to several non-equilibrium events. The central focus of this paper is on the collision-induced desorption (sputtering) of water molecules into the gas-phase from the ice surface. Sputtering is strongly activated with respect to xenon translational energy, and a threshold for desorpti...

We report interactions of low pressure Ar, H2, and Ar/H2 mixture plasmas with a-C:H films. Surface evolution and erosion of a-C:H films were examined for ion energies up to 200 eV by rf biasing the substrates. Film surfaces were characterized using in situ ellipsometry, x-ray photoelectron spectroscopy, and atomic force microscopy. Multilayer models for steady-state modified surface layers are ...

W–Mo thin films are prepared by magnetron co-sputtering using glancing angle deposition. The same deposition ?W = ?Mo 80° is used for both W and Mo targets. Two different sputtering pressures used: 0.33 Pa 1.5 Pa, which correspond to ballistic thermalized regimes of sputtered atoms, respectively. For each regime, target current kept at IW 140 mA, whereas gradually changes from IMo 10–200 mA. Bo...