Titanium (Ti) has been used for long in dentistry and medicine for implant purpose. During the years, not only the commercially pure Ti but also some alloys such as binary and tertiary Ti alloys were used. The aim of this review is to describe and compare the current literature on binary Ti alloys, including Ti-Zr, Ti-In, Ti-Ag, Ti-Cu, Ti-Au, Ti-Pd, Ti-Nb, Ti-Mn, Ti-Mo, Ti-Cr, Ti-Co, Ti-Sn, Ti-...

The present study compares castability and mechanical performance among alloys of c.p. Ti, Ti-6Al-7Nb and a newly-developed Ti-15Mo-1Bi in regard to their as-cast state. Experimental results indicate that average cast length of Ti-6Al-7Nb appears a little lower than c.p. Ti and Ti-15Mo-1Bi, although the differences are not significant. C.p. Ti has an hcp phase of lath-type morphology with serra...

INTRODUCTION To improve the fracture resistance of nickel-titanium (NiTi) files, manufacturers have introduced new alloys and developed new manufacturing processes for the fabrication of NiTi files. This study aimed to examine the phase transformation behavior and microstructure of NiTi instruments from a novel controlled memory NiTi wire (CM wire). METHODS Instruments of EndoSequence (ES), P...

introduction : to evaluate the efficacy of niti mechanical rotary instrumentation and hedstrom file for gutta-percha/sealer removal computed tomography (ct) was utilized in vitro . materials and methods: thirty extracted human single rooted teeth, each with a single canal were selected. the samples were decoronated with a double faced diamond disk to have 17-mm root; teeth roots were instrument...

introduction: the purpose of this study was to evaluate and compare canal preparation pattern of k3 and protaper rotary files in curved resin blocks. materials and methods: twenty-four resin blocks were used in this experimental study and randomly divided into two groups. their initial images were scanned. after preparation, their images were scanned again in the same position. pre and post pre...

Tungsten metal layer was used for the first time as an effective diffusion barrier for the standard Ti/Al/Ti/Au ohmic metallization scheme to obtain thermally stable ohmic contact suitable for high temperature applications. Comparative studies were performed on three distinct metallization schemes: 1) standard GaN/Ti/Al/Ti/Au, 2) GaN/Ti/Al/W/Au, and 3) GaN/Ti/Al/Ti/W/Au. For the GaN with doping...

2) and 3) together can be summarized by: If t0 = 0 < t1 < t2 < · · · < tk, then the increment rvs B(ti) − B(ti−1), i ∈ {1, . . . k}, are independent with B(ti) − B(ti−1) ∼ N(0, ti − ti−1) (normal with mean 0 and variance ti − ti−1). In particular, B(ti) − B(ti−1) is independent of B(ti−1) = B(ti−1)−B(0). If we only wish to simulate B(t) at one fixed value t, then we need only generate a unit no...