The following application note represents a general guideline for mounting LEDs of the Golden DRAGON with Lens product family. A basic overview of the construction of LEDs and important design rules for the development of LED systems are provided. In addition, the principal processing steps are illustrated for the Golden DRAGON ARGUS LED, and general information about mounting is summarized. In...

Silver sintering joints and AuGe soldering are promising technologies for high temperature (>200 C ambient) power electronics packaging. This paper presents the implementation of two silver-sintering processes with the one hand micrometer-scale silver particles, and on the other hand nano-meter-scale particles. Two substrates technologies have been investigated: A12O3 DBC and Si3N4 AMB. After t...

Just like soldering, wire bonding appears to be a simple process and is frequently taken for granted. People tend to think all that is required to have a high quality bonding process is a simple wire pull test to monitor and control the process. But like soldering, this process is complex and requires a thorough understanding of the metallurgy, thermodynamics, and surface chemistry involved. Th...

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during ...

We report a simple lithography-free, solution-based method of soldering of carbon nanotubes with Ohmic contacts, by taking specific examples of multi-walled carbon nanotubes (MWNTs). This is achieved by self-assembling a monolayer of soldering precursor, Pd(2+) anchored to 1,10 decanedithiol, onto which MWNTs could be aligned across the gap electrodes via solvent evaporation. The nanosoldering ...

The use of no-clean fluxes in liquid and solid form has grown considerably primarily for two reasons: to reduce costs and to minimize the environmental impact of soldering operations. At the same time, considerable work is progressing on no-clean fluxes for solder pastes. In order to build confidence in the technology, it is essential to prove that no-clean fluxes can produce good soldering per...

The main aim of this work was to determine the soldering, thermal and mechanical properties of joints fabricated by use of Au-20Sn solder. Soldered joints were fabricated by application of a flux-free process with assistance of power ultrasound. By acting of power ultrasound, the Au-20Sn solder wets the surface of Cu, Ag and Ni substrates. The contact wetting angle on all substrates varied with...

Anisotropic conductive film (ACF) has been used for flip chip interconnection of a silicon based MEMS finger print sensor to a signal processing ASIC. The assembled sensor device was subjected to a short term high temperature profile with peak temperature 260 C simulating subsequent reflow soldering of the device, and to thermal shock cycling from -40 to +85 C. The reliability of interconnect...

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive metallisation steps for both the ball and the cantilever, and subjects the solder pads used for mounting the cantilever to an additional reflow ...

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable ...