The formation of a TSV for three-dimensional interconnects using SF6/O2 plasma is explored. Adjusting the O2 gas concentration to 45 sccm, while the SF6 concentration is set to 35 sccm, produced the best combination of chemical and physical etching to provide sidewall angles of 88◦. Three TSV aspect ratios are etched (5/58, 10/100, and 20/100 μm) and subsequently analyzed using the finite eleme...

Electromigration (EM) is one of the main reliability concerns in copper interconnects. In particular, it is a critical issue for new emerging technologies, such as through silicon via (TSV) technology. In this work the impact of formation and growth of voids under a TSV located at the cathode end of a typical dual-damascene line is analyzed. The resistance change of the structure is numerically...

Test planning for core-based 3D stacked ICs with trough-silicon vias (3D TSV-SIC) is different from test planning for non-stacked ICs as the same test schedule cannot be applied both at wafer sort and package test. In this paper, we assume a test flow where each chip is tested individually at wafer sort and jointly at package test. We define cost functions and test planning optimization algorit...

In order to meet the requirements of high performance, miniaturization, low cost, power consumption and multi-function, three-dimensional (3D) integrated technology has gradually become a core technology. With development 3D technology, it been used in imaging sensors, optical microsystems, inertial sensor radio-frequency biological microsystems logic etc. Through silicon via (TSV) is system, w...

Most functions attributed to Tityus serrulatus venom (TsV) are related to active molecules on ion-channels; however, here we describe a new pentapeptide that was discovered through enzymatic assay selection using EP24.15. The primary structure analysis revealed the sequence KEXXG (X means Ile or Leu), similar to the sequence present in the β-KTX propeptide described from the venom of Tityus spp...

Pars plana vitrectomy (PPV) was introduced almost 40 years ago. 1 In the 1980s and 1990s, three-port PPV with 20-gauge (G) instruments was the norm. In 2002, 25-gauge transconjunctival sutureless vitrectomy (TSV) was introduced.2,3 This system permits threeport PPV using microcannulas, trocars, and 25-G instrumentation without requiring sutures to close the sclerotomies. Subsequently, a similar...

This paper proposes a holistic lexicon-reduction method for ancient and modern handwritten Arabic documents. The word shape is represented by the weighted topological signature vector (W-TSV), which encodes graph data into a low-dimensional vector space. Three directed acyclic graph (DAG) representations are proposed for Arabic word shapes, based on topological and geometrical features. Lexicon...

Strain measurements are demonstrated for through-silicon vias (TSVs) using synchrotron x-ray diffraction to characterize the effect of copper via dimensions and liner materials. Reduction in strains in the silicon around TSVs is observed for the TSVs with smaller via diameters and the TSVs with a thicker polymer liner. To interpret the measured two-dimensional (2D) TSV strain distribution maps ...

Restricting milk or replacer (MR) fed to dairy calves 10% of body weight at 12.5% total solids (TS) concentration is a common feeding strategy that promotes early weaning and lowers feed costs for raising young calves. However, this has been associated with inferior performance compromised welfare. Because restricted liquid nutrition plan limits calf growth due limited supply nutrients, researc...

This paper presents an in-depth investigation of the silicon substrate characteristics based on frequency-dependent parameters in through-silicon via (TSV)-based 3-D ICs. It is first time to define frequency bands accurately ground a quantitative standard calibration represent different substrate. Moreover, by converting conventional model TSV pair into <italic xmlns:mml="http://www.w3.org/1998...