This paper reports a microelectromechanical systems (MEMS) resonant varifocal mirror integrated with piezoresistive focus sensor. The varifocal mirror is driven electrostatically at a resonant frequency of a mirror plate to obtain the wide scanning range of a focal length. A piezoresistor is used to monitor the focal length of the varifocal mirror. The device is made of a silicon-on-insulator (...

An experimental evaluation of the structural health monitoring capability of piezoelectric wafer active sensors on composite structures at cryogenic temperatures is presented. The piezoelectric wafer active sensor–based electromechanical impedance and the pitch–catch methods were first qualified for cryogenic temperatures using piezoelectric wafer active sensor–instrumented composite specimens ...

The study of wafer level hermetic bonding using sub-micron gold particles with the mean diameter of 0.3_m was conducted at bonding temperature of 150 – 300 °C with varying bonding pressure in the range of 50 – 100 MPa. 4.5 mm-square, 10 μm – 100 μm-wide seal line patterns of sub-micron Au particles were formed on Si or glass wafers by means of wafer level processing using photolithography and s...

In such processes as wafer-grinding and LPCVD, the variation within a group of measurements is traceable to various causes, and therefore, needs to be decomposed into relevant components of variation for an effective equipment monitoring and diagnosis. In this article, an LPCVD process is considered as an example, and control charting methods are developed for monitoring various fixed and rando...

In this paper, a kind of multi-disciplinary simulation and design platform for wafer manufacturing process with Chamber system is presented. This platform is developed as an in-house program, with different functional component for multi-disciplinary problems, which can drive the commercial FEM solver with code. There are also management function for user, products, and analysis or optimization...

Scheduling is one of the most important issues in the planning of manufacturing systems. This research focuses on solving the test scheduling problem which arises in semiconductor manufacturing. Semiconductor wafer devices undergo a series of test processes conducted on computer-controlled test stations at various temperatures. A test process consists of both setup operations and processing ope...

Motivated by the yield optimization problem in semi-conductor manufacturing, we model the wafer to wafer integration problem as a multi-dimensional assignment problem and study it from an approximation point of view. We give approximation algorithms achieving an approximation factor of 3 2 and 4 3 for WWI-3. We show that a special case of yield optimization problem can be solved in polynomial t...

This paper focuses on lot release control and scheduling problems in a semiconductor wafer fab producing multiple products that have different due dates and different process flows. For lot release control, it is necessary to determine the type of a wafer lot and the time to release wafers into the wafer fab, while it is necessary to determine sequences of processing waiting lots in front of wo...

Through-silicon via (TSV) technology enables 3D-integrated devices with higher performance and lower cost as compared to 2D-integrated systems. This is mainly due to smaller dimensions of the package and shorter internal signal lengths with lower capacitive, resistive and inductive parasitics. This paper presents a novel low-cost fabrication technique for metal-filled TSVs with very high aspect...