Nine Al-(1-3)Mg-(0-0.4)Cu-0.15Si-0.25Mn (in wt%) alloys with potential applications in both packaging and automotive industries have been investigated. Tensile testing showed that solution strengthening is in good approximation linearly proportional to the Mg content. Mechanical testing and microstructural examinations of aged samples indicate that Mg2Si phase precipitates contribute to age har...

Thirty-two beef heifers were used to examine the effect of dietary copper depletion and repletion on neutrophil and lymphocyte functions. Heifers allotted to the control group (C+; n = 8) were fed a basal roughage/concentrate diet with Cu-sulfate supplementation (Cu > or = 8 ppm). To induce a Cu deficiency (depletion phase d 0 to 60), treated (T; n = 24) heifers received a diet supplemented wit...

Copper nanoparticles/fluorine-doped tin oxide (FTO) nanocomposites were successfully prepared by a simple hydrothermal method. The synthesized nanocomposites were characterized by X-ray diffraction (XRD), UV-visible diffuse-reflectance spectrum (UV-VIS DRS), energy dispersive X-ray (EDX), transmission electron microscopy (TEM), Raman spectra, and X-ray photoelectron spectroscopy (XPS). The obta...

Introduction: The abundance of Cu in the Earth’s mantle normalized to C1 and Mg is similar to the abundances of Ni and Co [1, 2]. This is surprising as Cu is much less siderophile [2] than Ni and Co. Although a lower bulk Earth abundance of Cu is expected because of its lower condensation temperature, this is not sufficient to compensate for the much lower one bar siderophility of Cu when compa...

The effect of electroplated Cu (EPC), electroplated Sn (EPS) and Cu addition (0.7 wt.%) on the void formation at the reaction interfacewas investigated through the reaction of solderswithCu substrates. The voidswere observed at the Cu3Sn/EPC interface in the Sn/EPC joints after aging at 150 C, while not at the Cu3Sn/high purity Cu (HPC) interface in the Sn/HPC joints even after aging at 180 C f...