نتایج جستجو برای: chip optical interconnects
تعداد نتایج: 315995 فیلتر نتایج به سال:
Free-space optical interconnects will soon be able to provide input/output bandwidths to a VLSI chip in excess of a terabit per second. The successful application of this technology to parallel distributed processing systems depends on the need for high-bandwidth interconnects and the ability of the architecture to sustain a stream of data at these bandwidths to the processing elements. We revi...
Quilt Packaging (QP), a novel chip-to-chip communication paradigm for system-in-package integration, is presented. By forming protruding metal nodules along the edges of the chips and interconnecting integrated circuits (ICs) through them, QP offers an approach to ameliorate the I/O speed bottleneck. A fabrication process that includes deep reactive ion etching, electroplating, and chemical-mec...
System-on-a-chip (SoC) has become possible since a great number of circuit elements can be integrated into a single chip by the miniaturization technologies for Si CMOS. Network-onChip (NoC) has been investigated actively, and it is expected to be a new approach for designing the communication subsystems of SoC (Lee et al., 2008). Enormous circuit blocks are loaded onto the NoC, and on-chip net...
To fulfill the functionality demands from the fast developing optical networks, a hybrid integration approach allows for combining the advantages of various material platforms. We have established a polymer-based hybrid integration platform (polyboard), which provides flexible optical input/ouptut interfaces (I/Os) that allow robust coupling of indium phosphide (InP)-based active components, pa...
This paper discusses propagation delay error, transient response, and power consumption distribution due to inductive effects in optimal buffered on-chip interconnects. Inductive effect is said to be important to consider in deep submicron (DSM) VLSI design. However, study shows that the effect decreases and can be neglected in next technology nodes for such conditions. key words: on-chip inter...
It is generally accepted that the most basic obstacle to continued advances in the speed of computing systems is metal connections. The bottleneck of current metal-based interconnection networks is typically the very limited bandwidth. Optics, due to its inherent parallelism, high bandwidth, freedom from planar constraints, and non-interfering communication, has been recognized as a possible so...
Silicon photonics integrated circuits (Si-PIC) with well-established active and passive building elements are progressing towards large-scale commercialization in optical communications and high speed optical interconnects applications. However, current Si-PICs do not have memory capabilities, in particular, the non-volatile memory functionality for energy efficient data storage. Here, we propo...
We report our recent successful experiences related to the development of a transcontinental course in silicon photonics offered by the University of British Columbia in collaboration with CMC Microsystems. The course is offered to students from across Canada and has attracted participants from nearly every Canadian university with an advanced photonics research program. The focus of the course...
Wavelength-scale optical modulators are essential building blocks for future on-chip optical interconnects. Any modulator design is a trade-off between bandwidth, size and fabrication complexity, size being particularly important as it determines capacitance and actuation energy. Here, we demonstrate an interesting alternative that is only 3 μm long, only uses silicon on insulator (SOI) materia...
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