Surface finishes are used to preserve and promote solderability of exposed copper metallization on printed wiring boards. While in the best of worlds, the solder used in assembly should dictate the solder interconnect reliability, surface finishes are known to have an effect. The effect of surface finishes on solder interconnect reliability can be particularly strong under high strain rate load...

The inner surface of a metallic tube (i.d. 0.5 mm) was coated with a palladium (Pd)-based thin metallic layer by flow electroless plating. Simultaneous plating of Pd and silver (Ag) from their electroless-plating solution produced a mixed distributed bimetallic layer. Preferential acid leaching of Ag from the Pd-Ag layer produced a porous Pd surface. Hydrogenation of p-nitrophenol was examined ...

By restricting the dilated deformation, surface modification can stimulate multiple shear banding and improve the plasticity of bulk metallic glasses (BMGs). Aimed at modifying the surface of BMGs by thin layers, a crystalline Ni coating with ultrafine grains was coated on the surface of a Ti-based BMG by electroless plating. With a thickness of about 10 μm, the prepared thin coating could effe...

Membranes are crucial in modern industry and both new technologies and materials need to be designed to achieve higher selectivity and performance. Exotic materials such as nanoparticles offer promising perspectives, and combining both their very high specific surface area and the possibility to incorporate them into macrostructures have already shown to substantially increase the membrane perf...

in the present study, ni-p-cnt composite coating was successfully fabricated via electroless plating. scanning electron microscopy (sem) was used to characterize the coatings. the effect of cnts concentration in the bath on its content in the composite coatings was studied. furthermore, the corrosion behaviour of the coatings with different contents of cnts was evaluated using tafel polarizatio...

silicon nanowire (sinw) arrays were produced by electroless method on polycrystalline si substrate, in hf/ agno3 solution. although the monocrystalline silicon wafer is commonly utilized as a perfect substrate, polycrystalline silicon as a low cost substrate was used in this work for photovoltaic applications. in order to study the influence of etching time (which affects the sinws length) on d...