نتایج جستجو برای: gold plating

تعداد نتایج: 92282  

2006
Wen Dai Wanjun Wang

In this talk, we report a research work on fabrication and metallization of high aspect ratio polymer microstructures fabricated using UV lithography of SU-8 on silicon substrate. Electroless plating of metal film on both the top and sidewall surfaces of microstructures were achieved while the silicon substrate was not plated. The primary chemical mechanisms and possible applications were also ...

Journal: :Microelectronics Reliability 2005
Daniel T. Rooney DeePak Nager David Geiger Dongkai Shanguan

Chip on board wire bonding presents challenges to modern wire bonding technology which include smaller, closely spaced wire bond pads; bonding to soft substrates without special processing and pad construction; and diverse first bond and second bond metallurgies. These challenges are addressed by extensive bonding accuracy tests, a design of experiments approach for optimizing wire bond process...

1995
Andrzej J. Buras Robert Fleischer

We present strategies for determining electroweak penguins from experimental data. Using the CKM-angle γ as one of our central inputs and making some reasonable approximations, we show that the b̄ → s̄ electroweak penguin amplitude can be determined in a two-step procedure involving i) BR(B → πK), BR(B− → π0K−), BR(B → πK) and ii) either BR(B d → π −K+), BR(B̄ d → π +K−) or aCP(t) of the mode Bs →...

1998
Amol S. Dighe

It is well known that sin(2β), where β is one of the angles of the unitarity triangle of the CKM matrix, can be determined in a theoretically clean way by measuring mixing-induced CP violation in the decay Bd → J/ψKS. Another clean extraction of this CKM angle is provided by the time-dependent angular distribution for the decay products of Bd → J/ψ(→ l +l−)K∗0(→ πKS), where we have more observa...

2013
Samuel Bearden Guigen Zhang

A conical nanopore was developed that allowed the ionic current to be gated by external application of electrical potential. A numerical model of the pore was created in COMSOL to elucidate the mechanism of action in this pore. The model is composed of a conical nanopore geometry with a gold-plated Si3N4 structure and a complete Gouy-Chapman-Stern electrical double layer. The Poisson, NernstPla...

2008
Robert Fleischer Thomas Mannel

We reanalyze the decay Bd → π+π− without assuming dominance of QCD penguins with internal top-quark exchanges. In that case the weak phase of the b̄ → d̄ QCD penguin amplitude is not related in a simple way to the CKM angle β. Nevertheless it is still possible to extract the CKM angle α in a transparent and almost modelindependent way from the time-dependent CP-violating asymmetry of the transiti...

2004
A Salim Safir

We analyze the impact of the forthcoming CP-violating observables in the Bs → K + K − system, combined with the precise measurement of sin 2β , in the extraction of the CKM matrix. Computing the penguin parameters (r, θ) within QCD factorization yields a precise determination of (¯ ρ, ¯ η), reflected by a weak dependence on θ, which is shown to be a second order effect. Using the SU (3)-flavour...

Journal: :Fusion Science and Technology 2023

Electroplating remains an attractive deposition approach for fabricating metal microspherical targets inertial confinement fusion because of its relatively fast rates and ability to produce full-density small grain coatings. Here, we discuss recent advances that allow coating thick (>60 µm) leak-free gold capsules with gradients silver. We present a new apparatus used electroplating hollow (typ...

2006
M. Shahrooz Amin Thomas F. Peterson Markus Zahn

Distilled water, tap water, Sargasso Sea water and 0.9% NaCl solution contained in a Nalgene 30ml polyallomer centrifuge tube are found to maintain distinct negative non-zero equilibrium charges as measured within a grounded patented Faraday cage. Here, the Faraday cage is composed of two identical in-line hollow, gold-plated Faraday cup electrodes which enclose the sample that moves between th...

Journal: :Microelectronics Reliability 2004
N. H. Yeung Victor Lau Y. C. Chan

Tape ball grid array (TBGA) rather than the traditional BGA, can provide a more flexible, light weight and fine pitch interconnection method to the electronic industry. In this study, two different designs of TBGA, buss-out and buss-in, were used thought-out this investigation. Moreover, for those samples were then further sub-divided, one with hot deionized (DI) rinsing after solder resist dev...

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