Grinding is the most common finishing method for hardened steel parts. accompanied by a large heat release in cutting area, under influence of which structural changes appear thin surface processed parts, tensile stress and even microcracks, significantly reduce operational reliability machines that include these The use abrasive wheels with an intermittent working makes it possible to temperat...

Recent developments in grinding have opened up new avenues for finishingof hard and brittle materials with Nano-surface finish, high tolerance and accuracy.Grinding with super abrasive diamond wheels is an excellent way to produce ultraprecision surface finish. However, super abrasive diamond grits need higher bondingstrength while grinding, which metal-bonded grinding wheels ca...

conputer pror,rae1 descrihed for practical optinization plun?;e grindin>; on steels. Tl1e program based on a strategy desiv,ned to o;Hi!'1ize both the grinding and dress "~nr, <Jara!'1eters maxil'1um metal removal rate, to constraints of surface finish and burning of the Forkpiece. The operates with a desktop micro-computer. performin?: the optimization, the user inputs the present grinding dre...

A on-line monitoring new method for grinding quality is presented based on theory analysis and test study, which collects the information of grinding quality from the AE signals produced by friction and grinding process to realize the on-line intelligent detection and prediction of grinding quality by A wavelet neural network & Fuzzy BP algorithm based network. The reliability and feasibility o...

The article provides a mathematical model of the vertical oscillations main shaft on elastic supports sewing machine, taking into account inertial forces, as well rigidity characteristics rubber supports. regularities designs are experimentally determined for various modes grinding materials. An effective design scheme bearing with shock absorbers machine has been developed and recommended.

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives on grinding of silicon wafers, impacts of wafer size progression on applications of grinding in silicon wafer manufacturing, and interrelationships between grinding and two oth...

Particle size alterations during neutral detergent fiber (NDF) determination and in situ rumen incubation were analyzed by dry sieving and image analysis to evaluate the in situ procedure for estimation of NDF degradation parameters and indigestible NDF concentration in terms of particle size. Early-cut and late-cut grass silages, corn silage, alfalfa silage, rapeseed meal, and dried distillers...