High-efficient heat dissipation materials are urgently required in advanced electronic packaging technology because effectively releasing the internal flow density of devices is a key factor during their operation. In this work, novel vertical graphene nanosheets/carbon fibers (VGNs/CF) composite film, with vertically oriented structure and excellent properties, fabricated on stainless steel su...

The increasing demand from the consumer for higher levels of refinement from their passenger vehicles has put considerable pressure on the automotive industry to produce ever quieter cars. In order to prevent the occurrence of many forms of brake noise, especially judder and drone, excessive heating of the brake disc must be avoided, whilst minimising temperature variations across the rotor. In...

There is a large promise for thermophones in high power sonar arrays, flexible loudspeakers and noise cancellation devices. The freestanding aerogel-like carbon nanotube sheet as a thermoacoustic (TA) heat source demonstrates so far the best performance. However, the limited accessibility of large size free standing carbon nanotube sheets and other even more exotic materials published recently,...

The magnetic field of the Earth is generated by convection in the liquid-core and the energy necessary for this process comes from the cooling of the core which provide several buoyancy sources. The thermodynamics of this system is used to relate the Ohmic dissipation in the core to all energy sources and to model the thermal evolution of the core. If the same dissipation is maintained just bef...

*Correspondence: Gang Zhang, Department of Engineering Mechanics, Institute of High Performance Computing, 1 Fusionopolis Way, #16-16 Connexis North, Singapore 138632, Singapore e-mail: [email protected] Graphene and Graphene nanoribbons (GNRs) are found to have superior high thermal conductivity favorable for high-performance heat dissipation. In this letter, by using molecular dynamic...

[1] Enceladus’ south polar region has a large heat flux, 55–110 mW m , that is spatially associated with cryovolcanic and tectonic activity. Tidal dissipation and vigorous convection in the underlying ice shell are possible sources of heat, however, prior predictions of the heat flux carried by stagnant lid convection range from Fconv 15 to 30 mW m , too low to explain the observed heat flux. T...

Since power dissipation is becoming a dominant limitation on the continued improvement of CMOS technology, technologists must understand the best way to design transistors in the presence of power constraints. The primary objective is to obtain as much performance as possible for a fixed amount of power, and it is chip performance, not device performance, that matters. In order to investigate t...

When solid materials and devices scale down in size, heat transfer from the active region to the gas environment becomes increasingly significant. We show that the heat transfer coefficient across the solid-gas interface behaves very differently when the size of the solid is reduced to the nanoscale, such as that of a single nanowire. Unlike for macroscopic solids, the coefficient is strongly p...

Miniature heat pipe (MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP on the very limited space of a notebook PC. A cross-sectional area of the pipe is reduced about 30% when the MHP with 4mm diameter is pressed to 2mm thickness. In this study, a performance test has been performed in order to r...