Electromigration and thermomigration reliability of Sn96.5%Ag3.0%Cu0.5 (SAC305 by weight) solder joints under alternating current is studied experimentally with the maximum current density from 2.1 10 A/cm to 1.76 10 A/cm, and frequency from 100 kHz to 4 MHz. During the experiment, hot spots are observed at current crowding corners and the skin layer of solder joints. As a result, highly locali...