نتایج جستجو برای: large epoxy model

تعداد نتایج: 2929067  

2013
Alexander Möllenberg Gerhard Spiteller

12,13-Epoxy-ll-hydroxy-9-octadecenoic Acid, 4,5-Epoxy-N-acetylsphingosine, Human Liver Microsomes Transformation of 12,13-epoxy-ll-hydroxy-9-octadecenoic acid and 4,5-epoxy-N-acetylsphingosine by addition of porcine liver homogenate and human liver microsomes, respec­ tively was investigated. Both epoxides were converted to corresponding dioles by porcine liver homogenate, but not by human live...

2016
Yuanfeng Pan Ying Pan Qingzheng Cheng Yi Liu Charles Essien Brian Via Xiaoying Wang Runcang Sun Steven Taylor

The effect of paraffin wax encapsulated microcrystalline cellulose (EMC) particles on the mechanical and physical properties of EMC/epoxy composites were investigated. It was demonstrated that the compatibility between cellulose and epoxy resin could be maintained due to partial encapsulation resulting in an improvement in epoxy composite mechanical properties. This work was unique because it w...

Improvement and stabilization of soils are widely used to improve the physical and mechanical properties of sandy soils. Despite the abundance of researchers that have been conducted on this topic to date, most of them have focused on dry soil. The effects of the existing water in the soil and different curing durations (curing environment) have not been investigated. In this study, different p...

In this paper, graphene oxide decorated with cerium oxide (CeO2) nanoparticles was prepared and used as anticorrosive pigments in epoxy nanocomposite coatings. The synthesized nanoparticle was characterized by FTIR, XRD, SEM, and EDX analyses. Graphene oxide decorated with CeO2 nanoparticles was dispersed in epoxy resin by sonication. The optimum nanoparticle content of th...

2011
S. S. Samsudin Z. M. Ariff Z. Zakaria A. A. Bakar

The present study focuses on the development and characterization of epoxy syntactic foam filled with epoxy hollow spheres (ESF/EHoS). The epoxy syntactic foam (ESF) was produced by embedding epoxy hollow spheres (EHoS) into a mixture of epoxy-hardener and 3% KOH solution. An innovative approach and simple procedure was implemented in the preparation of the EHoS where expanded polystyrene (EPS)...

2016
R. Sekula

Epoxy composites are broadly used as an electrical insulation for the high voltage applications since only such materials can fulfill particular mechanical, thermal, and dielectric requirements. However, properties of the final product are strongly dependent on proper manufacturing process with minimized material failures, as too large shrinkage, voids and cracks. Therefore, application of prop...

2016
A. Revathi M. Sendil Murugan Sandhya Rao Kavitha V. Rao

The creep and recovery of 5% carboxyl-terminated butadiene acrylonitrile (CTBN) modified epoxy shape memory polymers (SMP) was studied. The results were compared with those for the unmodified epoxy SMP. The glass transition temperatures (Tg) were determined using Advanced Rheometric Expansion System (ARES). The creep behavior of the unmodified epoxy and 5wt.% CTBN modified epoxy SMP were studie...

Journal: :journal of modern processes in manufacturing and production 0
hamzeh shahrajabian department of mechanical engineering, najafabad branch, islamic azad university, najafabad, iran masoud farahnakian department of mechanical engineering, najafabad branch, islamic azad university, najafabad, iran mehdi moghri department of polymer engineering, kashan branch, islamic azad university, kashan, iran

during the past decade, polymer nanocomposites have emerged relatively as a new and rapidly developing class of composite materials and attracted considerable investment in research and development worldwide.direct machining of polymers can be an option for personalized products and for manufacturing product samples. to obtain high quality products and reduce machining costs, it is very importa...

2007
H S Ku F Siu P L Mok E Siores J A R Ball

In the printed circuit board assembly (PCBA) industry, integrated circuit (IC) dies are attached onto the printed circuit board (PCB) with epoxy. The die pads are first connected to the PCB tracks with gold or aluminium wires, utilising an ultrasonic wire-bonding machine. The dies are then coated with thermally cured epoxy. The chip-on-board (COB) is finally placed in an electrical oven for bak...

Journal: :Histology and histopathology 1999
S H Brorson T Andersen S Haug I Kristiansen A Risstubben H Tchou J Ulstein

We wanted to examine the effect of antigen retrieval on epoxy sections where the tissue had been infiltrated by resin containing moderately increased amounts of accelerator. The concentration of accelerator DMP-30 (Tri(Dimethyl Amino Methyl) Phenol) was varied in the range of 0% to 4% in the infiltration step of the tissue processing. Some of the epoxy sections were fixed in osmium tetroxide, a...

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