In the world of MEMS processing today, fabrications of membrane are performed using bulk micromachining (BMM). However these techniques not easiest to integrate with CMOS standard process due to not compatible of the processing flow. An attractive alternative deployment of surface micromachining (SMM). There is a trend to use surface micromachining to their advantage of simplicity in design and...

Process design, development and integration to fabricate reliable MEMS devices on top of VLSI-CMOS electronics without damaging the underlying circuitry have been investigated throughout this dissertation. Experimental and theoretical results that utilize two " Post-CMOS " integration approaches will be presented. The first integration approach uses SiGe MEMS technology for the " Post-CMOS " mo...

Graphene is a two dimensional honeycomb structure of sp hybridized carbon atoms that has possibilities in many applications due to its excellent mechanical and electrical properties. One application for Graphene is in the field of sensors. Graphene’s electronic properties do not degrade when it undergoes mechanical strain which is advantageous for strain sensors. In this thesis, certain propert...

Low-frequency double-resonance quartz crystal oscillator circuit was developed with active inductance aiming the quick start-up in the intermittent operation on the sensor circuit and DC isolation using a Q-MEMS sensing crystal HTS-206. Allan standard deviation indicated 5 × 10−12, showing short range stability of the sensor circuit sufficient for the ubiquitous environmental sensor network.

This paper propose a new design and analysis of MEMS sensor array based on thermal stress and electric current properties. The COMSOL Multiphysics 4.3 software is used to design the sensor array of the sensing layer. The material selection is done based on the thermal analysis of the sensor array. The polysilicon yield a maximum displacement of 0.00143μm and also it is suitable for human skin. ...

A microinsulation concept has been designed for use in MEMS devices. The design is carried out in the context of a thermionic microbattery, which converts the decay heat from radioactive isotopes directly to electricity using a vacuum thermionic diode. The role of the microinsulation is to maintain the isotope source temperature high in order to maintain good conversion efficiency. This paper p...

The effect of packaging on the impact-carrying capacity of micro electro-mechanical systems (MEMS) is investigated, with specific reference to a translational accelerometer. By exploiting the small ratio between the masses of MEMS and package/die (typically 10 3 or less) a decoupled two-scale, finite element approach is adopted: at the package/die length-scale the dynamics of whole device after...

Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based ...

A micromachined electrostatically-suspended accelerometer (MESA) is a kind of three-axis inertial sensor based on fully-contactless electrostatic suspension of the proof mass (PM). It has the potential to offer broad bandwidth, high sensitivity, wide dynamic range and, thus, would be perfectly suited for land seismic acquisition. Previous experiments showed that it is hard to lift up the PM suc...

Three-dimensional (3D) integration of microand nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. 3D ...