High-pressure drops characteristic of microchannel heat sinks (MCHS) is an issue that needs to be addressed reduce the size heat-removing devices in compact electronic devices. Supercritical carbon dioxide (s-CO₂) a suitable candidate being proposed as alternative coolant enhance cooling sink (MCHS), with high flux, due its favorable thermophysical properties near critical point. In this study,...

The historical development of thermodynamics follows the industrial revolution in the 19 century, and the advent of heat engines. It is interesting to see how such practical considerations as the efficiency of engines can lead to abstract ideas like entropy. An idealized heat engine works by taking in a certain amount of heat QH , from a heat source (for example a coal fire), converting a porti...

the fluid flow and heat transfer in a three-dimensional microchannel filled with al2o3- water nanofluid is numerically investigated. the hybrid scheme is used to discretize the convection terms and simpler algorithm is adopted to couple the velocity and pressure field in the momentum equations. the temperature fields, variation of horizontal velocity along the centre line of the channel, averag...

As the scale of devices becomes small, thermal control and heat dissipation from these devices can be effectively accomplished through the implementation of microchannel passages. The small passages provide a high surface area to volume ratio that enables higher heat transfer rates. High performance microchannel heat exchangers are also attractive in applications where space and/or weight const...

In this paper, the cooling performance of water-cooled heat sinks for heat dissipation from electronic components is investigated numerically. Computational Fluid Dynamics (CFD) simulations are carried out to study the rectangular and circular cross-sectional shaped heat sinks. The sectional geometry of channels affects the flow and heat transfer characteristics of minichannel heat sinks. T...

Ab = heat-sink-base surface area Ac = cross-sectional area of the fin Cp = specific heat of the air EI = Elenbaas number g = gravity H = fin height h = heat transfer coefficient around fin ka = thermal conductivity of the air kh = thermal conductivity of the heat sink L = fin length N = total number of fins of the heat sink P = plate-air parameter Pe = perimeter of the fin pf = fin pitch qb = h...

Advances in manufacturing techniques are inspiring the design of novel integrated microscale thermal cooling devices seeking to push the limits of current thermal management solutions in high heat flux applications. These advanced cooling technologies can be used to improve the performance of high power density electronics such as GaN-based RF power amplifiers. However, their optimal design req...