This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-...

Flip chip joining technology using anisotropically conductive films (ACFs) has become an attractive technique for electronic packaging. However, several factors have hindered the wide spread use of this technology. Along with the reliability issue, these factors also include the low availability and high cost of the bumped wafers. This paper introduces the feasibilities of using unbumped die wi...

Flip chip interconnections using anisotropic conductive film (ACF) are now a very attractive technique for electronic packaging assembly. Although ACF is environmentally friendly, many factors may influence the reliability of the final ACF joint. External mechanical loading is one of these factors. Finite element analysis (FEA) was carried out to understand the effect of mechanical loading on t...

This study investigated the influence of commercially available food preservatives: Natamax® (containing natamycin) and Nisaplin® nisin) on antimicrobial properties LDPE film, commonly used for packaging. Studies have shown that addition 3% or, alternatively, 5% provides an film with effective protection. The applied biocides did not significantly affect strength rheological LDPE. However, diff...

Biopolymer films based on apple skin powder (ASP) and carboxymethylcellulose (CMC) were developed with the addition of apple skin extract (ASE) and tartaric acid (TA). ASP/CMC composite films were prepared by mixing CMC with ASP solution using a microfluidization technique to reduce particle size. Then, various concentrations of ASE and TA were incorporated into the film solution as an antioxid...

In the present research the antimicrobial activity of two active packaging materials on the spoilage microbiota of fresh salmon fillets was tested. A PET-coated film (PET: Polyethylene Terephthalate) containing lysozyme and lactoferrin was tested in parallel with a carvacrol-coextruded multilayer film. Salmon fillet samples were stored up to four days at 0 and 5 ̋C, comparatively. The carvacrol...

In this study, inulin (INU) extracted from burdock root was utilized as a new film base material and combined with chitosan (CHI) to prepare composite films. Oregano and thyme essential oils (OT) were incorporated into the INU-CHI film to confer the films with bioactivities. The physical and optical properties as well as antioxidant and antimicrobial activities of the films were evaluated. INU ...

Wafer-level packaging (WLP) technology offers novel opportunities for the realisation of highquality on-chip passives needed in RF front-ends. IMEC proposes thin-film WLP technology in combination with 90nm CMOS as a cost-effective approach to integrate RF and microwave systems. The potential of this technology is assessed by means of two demonstrator sub-circuits: a low-power voltage-controlle...

This paper presents an overview of recent state of the art technologies and future trends in millimeter-wave MMIC packaging in the aspects of low cost, high productivity and high functionality. Developments of ceramic packages up to W-band have been progressed by design innovation. LTCC Technology with thick film printing has realized low-cost packages and 60GHz-band antenna integrated MCMs. Mu...