نتایج جستجو برای: reflow

تعداد نتایج: 2586  

Journal: :Circulation 1987
D E Jansen J R Corbett L M Buja C Hansen V Ugolini R W Parkey J T Willerson

Previously, technetium-99m-stannous pyrophosphate (99mTc-PPi) has been used to localize and estimate the size of myocardial infarcts in animals after permanent coronary artery occlusion. This study tested the hypothesis that 99mTc-PPi accurately sizes myocardial infarctions produced by temporary coronary artery occlusion and reflow in dogs. Three groups of dogs were studied: group A underwent 3...

2014
Xianzhi He Xinhong Wan Mingjuan Luo Haiyu Wang Qinghua Zhong Wenjun Peng Jianfang Xue

Objective: Evaluate whether early routine post-fibrinolysis angioplasty represents a reasonable reperfusion option for victims of ST-elevation myocardial infarction (STEMI), so that these patients could benefit more. Methods: A total of 936 STEMI patients were enrolled in this study to full Urokinase within 3 hours (h) followed by stenting within 3 12 h (Ultra early routine post-fibrinolysis an...

Journal: :Cardiology journal 2012
Jeffrey D Nadelson Mladen I Vidovich

A 57-year-old man presented with new anginal symptoms nine years after three-vessel coronary artery bypass grafting. Cardiac catherization revealed severely and diffusely diseased saphenous vein graft to the obtuse marginal coronary artery. Percutaneous coronary intervention was complicated by the ‘no-reflow’ phenomenon. The patient suffered a periprocedural myocardial infarction (peak troponin...

Journal: :Micromachines 2016
Nguyen Van Toan Masaya Toda Takahito Ono

This paper presents processes for glass micromachining, including sandblast, wet etching, reactive ion etching (RIE), and glass reflow techniques. The advantages as well as disadvantages of each method are presented and discussed in light of the experiments. Sandblast and wet etching techniques are simple processes but face difficulties in small and high-aspect-ratio structures. A sandblasted 2...

2016
Yoshiki Yamakoshi Sei-ichiro Motegi Osamu Ishikawa

Blood circulation function of peripheral blood vessels in skin dermis was evaluated employing an optical sensor with a pressurization mechanism using the blood outflow and reflow characteristics. The device contains a light source and an optical sensor. When applied to the skin surface, it first exerts the primary pressure (higher than the systolic blood pressure), causing an outflow of blood f...

Journal: :Stroke 1991
G J del Zoppo G W Schmid-Schönbein E Mori B R Copeland C M Chang

BACKGROUND AND PURPOSE Microvascular perfusion defects may accompany sustained occlusion and subsequent reperfusion of the middle cerebral artery; however, the nature of such "no-reflow" defects remains unclear. METHODS In the absence of antithrombotic pretreatment, we documented lenticulostriatal microvascular flow integrity following 3-hour middle cerebral artery occlusion and 1-hour reperf...

2001
Kuo-Ning Chiang Chang-An Yuan

The trend to reduce the size of electronic packages and develop increasingly sophisticated electronic devices with more, higher density inputs/outputs (I/Os), leads to the use of area array packages using chip scale packaging (CSP), flip chip (FC), and wafer level packaging (WLP) technologies. Greater attention has been paid to the reliability of solder joints and the assembly yield of the surf...

2014
Karine Pernet Fiona Ecarnot Romain Chopard Marie-France Seronde Philoktimon Plastaras Francois Schiele Nicolas Meneveau

BACKGROUND Microvascular obstruction (MVO) at the acute phase of myocardial infarction (MI) is associated with poor prognosis. We aimed to evaluate the correlation between plasma cardiac troponin I (cTnI) at the acute phase of MI and extent of no-reflow, as assessed by 3-T cardiac magnetic resonance imaging (MRI). Secondly, we defined a cut-off value for cTnI predictive of no-reflow. METHODS ...

2000

The research summarized in this paper will help to address some of the issues associated with solder paste mass reflow assembly of 0201 components. Attachment pad design, stencil design, component to component spacing, component orientation, flux type, and solder paste reflow atmosphere were the major variables researched during the project. The two major responses from the experimentation were...

Journal: :Metals 2021

This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions flexible printed circuit board (FPCB) in soldering process. A computer-based model that imitates a real-time was developed with practical boundary conditions. Since radiation effect is dominant process, discrete ordinate (DO) selected to simulate effect. The experimental work acts as ben...

نمودار تعداد نتایج جستجو در هر سال

با کلیک روی نمودار نتایج را به سال انتشار فیلتر کنید