We demonstrated soldering of an electrical component (the metal-oxide semiconductor field effect transistor (MOSFET)) on a printed circuit bord (PCB) via solder paste heated by microwave irradiation. The behavior the object soldered with in magnetic and electric were evaluated using various resonators. In field, was selectively confirmed that MOSFET connected onto PCB without any damage operate...

We report design and test results of a new thermal contact method for PrNi $$_5$$ rod, nuclear coolant compact continuous demagnetization refrigerator (CNDR) which can keep temperature below 1 mK continuously, using Zn soldering rather than Cd soldering. By measuring residual electrical resistance short piece, the resistivity between rod an Ag wires link was estimated as $$1.8\pm 0.1 \times 10^...

ABSTRACT A novel hydrogen activation technology based on activated or electron attachment (EA) has been developed for fluxless soldering at ambient pressure and normal temperature. The the potential to be used several applications in electronics packaging industry. Recent work from a joint effort between Air Products Sikama International alpha trials of production-scale furnace flux-free wafer ...