Heat transfer fluids have inherently low thermal conductivity that greatly limits the heat exchange efficiency. While the effectiveness of extending surfaces and redesigning heat exchange equipments to increase the heat transfer rate has reached a limit, many research activities have been carried out attempting to improve the thermal transport properties of the fluids by adding more thermally c...

Global warming may pose a greater risk to species with unique thermal requirements during each life stage than species with a similar thermal requirement throughout all life stages. The risk to the former is higher because their unique thermal ranges may become geographically or temporally discontiguous. Additionally, modeling global warming’s effects on these species is challenging due to thei...

Net-shape liquid composite molding (LCM) processes for the manufacturing of composite structures involve the permeation of a reactive thermoset polymeric resin through complex, fiber woven preforms. The physical behavior during the processing thus involves coupled multi-physics phenomena consisting of mass, thermal and species transport. The flow process models based on conservation of mass are...

MODELING THE EFFECT OF WATER ACTIVITY ON THERMAL RESISTANCE OF SALMONELLA IN WHEAT FLOUR By Danielle F. Smith Salmonella is able to survive in low-moisture environments, is known to be more heat resistant as product water activity decreases, and recently has been implicated in several outbreaks and/or recalls associated with low-moisture foods. Therefore, the specific objectives were to: (1) Ev...

This paper proposes a novel signal processing approach to thermal non-destructive testing by incorporating Gaussian window function onto the linear frequency modulated incident heat flux to achieve better pulse compression properties. The present work highlights a finite element analysis based modeling and simulation technique in order to test the capabilities of the proposed windowing scheme o...

Thermal conductivity is important for almost all applications involving heat transfer. The theory and modeling of crystalline materials is in some sense a solved problem, where one can now calculate their thermal conductivity from first principles using expressions based on the phonon gas model (PGM). However, modeling of amorphous materials still has many open questions, because the PGM itself...

This work shows results of dynamic lumpedelement (LE) thermal modeling of power AlGaN/GaN HEMTs. A realistic 3D structure including top-side metals, GaN-Si thermal boundary resistance, die-attach, and source via hole is modeled using a finite-element (FE) tool, and the results are used to develop simplified LE dynamic thermal models. We show that the LE models can match the FE data with excelle...

This paper presents a new method for modeling fluids and solids for the purposes of computer graphics and animation. The model, based on molecular and Newtonian dynamics, describes the changes in geometry and movement of elemental volumes as a consequence of thermal energy and external forces . At "hot" temperatures objects exhibit fluid-like behavior with rapidly varying geometry. At "cold" te...

Nanoimprint lithography (NIL) is a promising nanomanufacturing technology that offers an alternative to traditional photolithography for manufacturing next-generation semiconductor devices. This technology involves coating an ultraviolet (UV)-curable monomer layer on the substrate and then imprinting it with a template containing topography corresponding to the desired substrate features. While...