Synergistically regulating carrier and phonon transport on the nanoscale is extremely difficult for all thermoelectric (TE) materials without cage structures. Herein BaFe12O19/Bi2Te25Se0.5 thermoelectromagnetic nanocomposites are designed synthesized as a benchmarking example to simultaneously tailor properties nanoscale. A magneto-trapped effect induced by BaFe12O19 hard-magnetic nanoparticles...

Abstract We assess the performance of thermal ion imaging (TII) technique as conceived for Swarm Earth Explorer satellites. Analysis, simulation, and laboratory testing performed prior to flight provided estimates systematic random error sources electric field instrument’s vector drift, field, kinetic temperature measurements. An end-to-end instrument simulator, consisting models TIIs on a prot...

Using solar energy to cover heating loads of building is a clean and unconventional way that can help reduce electricity consumption. Problems the cost environmental pollution are among most important challenges facing humanity at present time. And as used for ventilation, thus need find renewable sources has become pressing need. In this direction Trombe wall, which classical passive one venti...

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The collaboration between Sharp Laboratories of America (SLA), Oregon State University (OSU) and ORNL focused on low thermal budget pulse thermal processing (PTP) technique to develop high performance copper zinc tin sulfide (CZTS) thin film system for advanced photovoltaic (PV) applications, with the goal to develop novel fabrication processes for the manufacture of low-cost, high-performance ...

Seawater cooling towers have been used since the 1970’s in power generation and other industries, so as to reduce the consumption of freshwater. The salts in seawater are known to create a number of operational problems including salt deposition, packing blockage, corrosion, and certain environmental impacts from salt drift and blowdown return. In addition, the salinity of seawater affects the ...

With the continued increase in power dissipation and power density of high-performance microprocessors, as well as requirements for high-density packaging and lower device junction temperatures, improvements of electronic cooling technologies have been becoming strategically important in the challenge of advanced thermal solutions for achieving higher cooling efficiencies while meeting reliabil...