A new self-consistent dynamic electro-thermal model for power HBTs is presented coupling a circuit-oriented electrical model, fitted on experimental data, with a full frequency domain thermal model. The thermal model provides the exact frequency behaviour of the device thermal impedance through a quasi-3D approach. The electro-thermal self-consistent solution is achieved, in large-signal period...

Exceeding component maximum ratings due to transient events like current spikes can lead to premature failure of surface mount resistors due to thermal and electrical overstress. In order to accurately evaluate device parameters and their impact on the circuit behavior a coupled electro-thermal simulation method must be applied under the influence of packaging. This article presents an analysis...

Computer models used to predict building heating and cooling energy and occupant thermal comfort at present rely on climate data collected at a remote meteorological station. No account is taken of the changes in meteorological conditions caused by the urban developments, yet it is known the differences can be important. This paper reports on a project aimed at the development of a computer sim...